Invention Application
- Patent Title: ETCHANT FOR METAL WIRING AND METHOD FOR MANUFACTURING METAL WIRING USING THE SAME
- Patent Title (中): 金属接线用金属接头及其制造金属接线方法
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Application No.: US13032563Application Date: 2011-02-22
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Publication No.: US20110226727A1Publication Date: 2011-09-22
- Inventor: Nam-Seok SUH , Sun-Young HONG , Jong-Hyun CHOUNG , Bong-Kyun KIM , Hong-Sick PARK , Jean-Ho SONG , Wang-Woo LEE , Do-Won KIM , Sang-Woo KIM , Won-Guk SEO , Hyun-Cheol SHIN , Ki-Beom LEE , Sam-Young CHO
- Applicant: Nam-Seok SUH , Sun-Young HONG , Jong-Hyun CHOUNG , Bong-Kyun KIM , Hong-Sick PARK , Jean-Ho SONG , Wang-Woo LEE , Do-Won KIM , Sang-Woo KIM , Won-Guk SEO , Hyun-Cheol SHIN , Ki-Beom LEE , Sam-Young CHO
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2010-0024250 20100318
- Main IPC: C23F1/18
- IPC: C23F1/18 ; H05K3/06 ; C23F1/30 ; C09K13/00
Abstract:
Exemplary embodiments of the present invention provide a metal wiring etchant. A metal wiring etchant according to an exemplary embodiment of the present invention includes ammonium persulfate, an organic acid, an ammonium salt, a fluorine-containing compound, a glycol-based compound, and an azole-based compound.
Public/Granted literature
- US08377325B2 Etchant for metal wiring and method for manufacturing metal wiring using the same Public/Granted day:2013-02-19
Information query
IPC分类:
