发明申请
- 专利标题: LASER MACHINING DEVICE AND LASER MACHINING METHOD
- 专利标题(中): 激光加工设备和激光加工方法
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申请号: US13264640申请日: 2010-05-14
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公开(公告)号: US20120031883A1公开(公告)日: 2012-02-09
- 发明人: Kenji Kumamoto , Yushi Takenaka , Kazuki Kuba , Toru Murai , Taira Ogita , Junichi Nishimae , Keisuke Furuta
- 申请人: Kenji Kumamoto , Yushi Takenaka , Kazuki Kuba , Toru Murai , Taira Ogita , Junichi Nishimae , Keisuke Furuta
- 申请人地址: JP Chiyoda-ku, Tokyo
- 专利权人: MITSUBISHI ELECTRIC CORPORATION
- 当前专利权人: MITSUBISHI ELECTRIC CORPORATION
- 当前专利权人地址: JP Chiyoda-ku, Tokyo
- 优先权: JP2009-125440 20090525
- 国际申请: PCT/JP2010/058224 WO 20100514
- 主分类号: B23K26/00
- IPC分类号: B23K26/00 ; B23K26/36
摘要:
The machining device is equipped with a fiber laser oscillator for oscillating laser light of a top hat shape, and a light collecting lens and a machining head for collecting the laser light of the top hat shape and emitting the laser light onto a machining target such that the beam diameter of the laser light of the top hat shape at a position where light intensity becomes the one corresponding to a machining threshold of the machining target is about three times the size of the beam diameter of laser light in a Gaussian mode at the same position, when the laser light in the Gaussian mode has a beam quality substantially the same as that of the laser light of the top hat shape.
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