发明申请
- 专利标题： METHOD OF FABRICATING EMBEDDED COMPONENT PACKAGE STRUCTURE AND THE PACKAGE STRUCTURE THEREOF
- 专利标题（中）： 嵌入式组件封装结构的制作方法及其包装结构
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申请号： US12850872申请日： 2010-08-05
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公开(公告)号： US20120033394A1公开(公告)日： 2012-02-09
- 发明人: Yuan-Chang Su , Shih-Fu Huang , Bernd Karl Appelt , Ming-Chiang Lee
- 申请人： Yuan-Chang Su , Shih-Fu Huang , Bernd Karl Appelt , Ming-Chiang Lee
- 申请人地址： TW Kaohsiung
- 专利权人： ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- 当前专利权人： ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- 当前专利权人地址： TW Kaohsiung
- 主分类号： H05K7/10
- IPC分类号： H05K7/10 ; H05K3/42 ; H05K3/30
摘要：
The present invention directs to fabrication methods of the embedded component package structures by providing preformed lamination structures, joining or stacking the preformed laminate structures and mounting at least one electronic component to the joined structures. By way of the fabrication methods, the production yield can be greatly improved with lower cycle time.
公开/授权文献
- US08284561B2 Embedded component package structure 公开/授权日：2012-10-09
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