Invention Application
- Patent Title: Substrate structure and method of manufacturing the same
- Patent Title (中): 基板结构及其制造方法
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Application No.: US13373297Application Date: 2011-11-10
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Publication No.: US20120171432A1Publication Date: 2012-07-05
- Inventor: Chul Min Lee , Won Hyung Park , Kyung Jin Heo , Dek Gin Yang , Jin Su Yeo , Sung Wook Chun
- Applicant: Chul Min Lee , Won Hyung Park , Kyung Jin Heo , Dek Gin Yang , Jin Su Yeo , Sung Wook Chun
- Applicant Address: KR Suwon
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon
- Priority: KR10-2010-0137733 20101229
- Main IPC: B32B3/00
- IPC: B32B3/00 ; B23K1/20 ; B05D1/32 ; B23K31/02 ; B05D5/12 ; B05D1/36
Abstract:
Provided is a substrate structure including: a base substrate on which a conductive pattern is formed; a first plating layer covering the conductive pattern; and a second plating layer covering the first plating layer, wherein the first plating layer includes an electroless reduction plating layer.
Public/Granted literature
- US08759986B2 Substrate structure and method of manufacturing the same Public/Granted day:2014-06-24
Information query
