发明申请
- 专利标题： Circuit boards, connectors, cases, circuit board assemblies, case assemblies, devices and methods of manufacturing the same
- 专利标题（中）： 电路板，连接器，壳体，电路板组件，壳体组件，装置及其制造方法
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申请号： US13678115申请日： 2012-11-15
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公开(公告)号： US20130077270A1公开(公告)日： 2013-03-28
- 发明人: Hyo-Jae BANG , Dogeun KIM , Hongkyun KIM , Youngbok JEON
- 申请人： Hyo-Jae BANG , Dogeun KIM , Hongkyun KIM , Youngbok JEON
- 优先权： KR10-2008-0088919 20080909
- 主分类号： H05K1/11
- IPC分类号： H05K1/11 ; H05K13/00 ; H05K3/30 ; H01R13/00 ; H05K7/02 ; H05K3/10
摘要：
Example embodiments are directed to circuit boards, connectors, cases, circuit board assemblies, case assemblies, devices and methods of manufacturing the same, which are common to at least two different form factors.
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