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1.发明申请CIRCUIT BOARDS, CONNECTORS, CASES, CIRCUIT BOARD ASSEMBLIES, CASE ASSEMBLIES, DEVICES AND METHODS OF MANUFACTURING THE SAME 审中-公开电路板，连接器，电路板组件，壳体组件，装置及其制造方法公开(公告)号：US20100062617A1
公开(公告)日：2010-03-11
申请号：US12349678
申请日：2009-01-07
申请人： Hyojae Bang , Dogeun Kim , Hongkyun Kim , Youngbok Jeon
发明人： Hyojae Bang , Dogeun Kim , Hongkyun Kim , Youngbok Jeon
CPC分类号： H05K5/0026 , G06F1/18 , G06F1/185 , G06K7/0047 , H01R12/00 , H01R12/57 , H01R12/721 , H01R13/00 , H01R27/00 , H05K1/0295 , H05K1/11 , H05K1/117 , H05K1/181 , H05K3/10 , H05K3/303 , H05K3/3405 , H05K7/02 , H05K13/00 , H05K2201/09409 , H05K2201/09709 , H05K2201/09954 , H05K2201/10159 , H05K2201/10189 , H05K2201/10446 , Y10S439/946 , Y10S439/951 , Y10T29/49124 , Y10T29/49147
摘要： Example embodiments are directed to circuit boards, connectors, cases, circuit board assemblies, case assemblies, devices and methods of manufacturing the same, which are common to at least two different form factors.
摘要翻译： 示例性实施例涉及电路板，连接器，外壳，电路板组件，壳体组件，其制造方法及其制造方法，这对于至少两种不同的形状因子是共同的。
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2.发明授权Device including circuit board with different form factor terminal sets and assemblies including the same 有权设备包括具有不同形状因子的电路板端子组和包括其的组件公开(公告)号：US08982567B2
公开(公告)日：2015-03-17
申请号：US13678115
申请日：2012-11-15
申请人： Hyo-Jae Bang , Dogeun Kim , Hongkyun Kim , Youngbok Jeon
发明人： Hyo-Jae Bang , Dogeun Kim , Hongkyun Kim , Youngbok Jeon
IPC分类号： H05K1/14 , H05K1/11 , G06K7/00 , H01R12/57 , H01R12/50 , H01R13/00 , H05K3/10 , H05K3/30 , H05K7/02 , H05K13/00 , H01R27/00 , H05K1/02 , H05K3/34
CPC分类号： H05K5/0026 , G06F1/18 , G06F1/185 , G06K7/0047 , H01R12/57 , H01R12/721 , H01R13/00 , H01R23/70 , H01R27/00 , H05K1/0295 , H05K1/11 , H05K1/117 , H05K1/181 , H05K3/10 , H05K3/303 , H05K3/3405 , H05K7/02 , H05K13/00 , H05K2201/09409 , H05K2201/09709 , H05K2201/09954 , H05K2201/10159 , H05K2201/10189 , H05K2201/10446 , Y10S439/946 , Y10S439/951 , Y10T29/49124 , Y10T29/49147
摘要： Example embodiments are directed to circuit boards, connectors, cases, circuit board assemblies, case assemblies, devices and methods of manufacturing the same, which are common to at least two different form factors. According to example embodiments, a solid state device (SSD) may include a circuit board, a connector, and a case. The circuit board may include a unibody board common to at least a first and a second form factor, first circuit board connection terminals of the first form factor on a front side of the board, and second circuit board connection terminals of the second form factor on a back side of the board. The connector may include connector connection terminals, where only one of the first circuit board connection terminals and the second circuit board connection terminals are connected to the connector connection terminals.
摘要翻译： 示例性实施例涉及电路板，连接器，外壳，电路板组件，壳体组件，其制造方法及其制造方法，这对于至少两种不同的形状因子是共同的。 根据示例性实施例，固态设备（SSD）可以包括电路板，连接器和外壳。 电路板可以包括至少第一和第二形状因子共同的一体板，在板的正面上的第一形状因子的第一电路板连接端子和第二形状因子的第二电路板连接端子 董事会的背面。 连接器可以包括连接器连接端子，其中仅一个第一电路板连接端子和第二电路板连接端子连接到连接器连接端子。
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3.发明申请Circuit boards, connectors, cases, circuit board assemblies, case assemblies, devices and methods of manufacturing the same 有权电路板，连接器，壳体，电路板组件，壳体组件，装置及其制造方法公开(公告)号：US20130077270A1
公开(公告)日：2013-03-28
申请号：US13678115
申请日：2012-11-15
申请人： Hyo-Jae BANG , Dogeun KIM , Hongkyun KIM , Youngbok JEON
发明人： Hyo-Jae BANG , Dogeun KIM , Hongkyun KIM , Youngbok JEON
CPC分类号： H05K5/0026 , G06F1/18 , G06F1/185 , G06K7/0047 , H01R12/57 , H01R12/721 , H01R13/00 , H01R23/70 , H01R27/00 , H05K1/0295 , H05K1/11 , H05K1/117 , H05K1/181 , H05K3/10 , H05K3/303 , H05K3/3405 , H05K7/02 , H05K13/00 , H05K2201/09409 , H05K2201/09709 , H05K2201/09954 , H05K2201/10159 , H05K2201/10189 , H05K2201/10446 , Y10S439/946 , Y10S439/951 , Y10T29/49124 , Y10T29/49147
摘要： Example embodiments are directed to circuit boards, connectors, cases, circuit board assemblies, case assemblies, devices and methods of manufacturing the same, which are common to at least two different form factors.
摘要翻译： 示例性实施例涉及电路板，连接器，外壳，电路板组件，壳体组件，其制造方法及其制造方法，这对于至少两种不同的形状因子是共同的。
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4.发明申请公开(公告)号：US20150156876A1
公开(公告)日：2015-06-04
申请号：US14622328
申请日：2015-02-13
申请人： Hyojae BANG , Dogeun KIM , Hongkyun KIM , Youngbok JEON
发明人： Hyojae BANG , Dogeun KIM , Hongkyun KIM , Youngbok JEON
IPC分类号： H05K1/11
CPC分类号： H05K5/0026 , G06F1/18 , G06F1/185 , G06K7/0047 , H01R12/57 , H01R12/721 , H01R13/00 , H01R23/70 , H01R27/00 , H05K1/0295 , H05K1/11 , H05K1/117 , H05K1/181 , H05K3/10 , H05K3/303 , H05K3/3405 , H05K7/02 , H05K13/00 , H05K2201/09409 , H05K2201/09709 , H05K2201/09954 , H05K2201/10159 , H05K2201/10189 , H05K2201/10446 , Y10S439/946 , Y10S439/951 , Y10T29/49124 , Y10T29/49147
摘要： Example embodiments are directed to circuit boards, connectors, cases, circuit board assemblies, case assemblies, devices and methods of manufacturing the same, which are common to at least two different form factors.
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