- 专利标题： Methods for Stud Bump Formation and Apparatus for Performing the Same
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申请号： US13527459申请日： 2012-06-19
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公开(公告)号： US20130167373A1公开(公告)日： 2013-07-04
- 发明人: Chien Ling Hwang , Yeong-Jyh Lin , Yi-Li Hsiao , Ming-Da Cheng , Tsai-Tsung Tsai , Chung-Shi Liu , Mirng-Ji Lii , Chen-Hua Yu
- 申请人： Chien Ling Hwang , Yeong-Jyh Lin , Yi-Li Hsiao , Ming-Da Cheng , Tsai-Tsung Tsai , Chung-Shi Liu , Mirng-Ji Lii , Chen-Hua Yu
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 主分类号： B26D7/27
- IPC分类号： B26D7/27 ; H01R43/00
摘要：
An apparatus includes a spool configured to supply a wire, a cutting device configured to form a notch in the wire, and a capillary configured to bond the wire and to form a stud bump. The apparatus is further configured to pull the wire to break at the notch, with a tail region attached to the stud bump.
公开/授权文献
- US09021682B2 Apparatus for stud bump formation 公开/授权日：2015-05-05
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