Invention Application
- Patent Title: SUBSTRATES WITH CONDUCTIVE COATINGS
- Patent Title (中): 带导电涂层的基材
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Application No.: US13438236Application Date: 2012-04-03
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Publication No.: US20130260094A1Publication Date: 2013-10-03
- Inventor: Yiliang Wu , Sandra J. Gardner , Ping Liu , Nan-Xing Hu
- Applicant: Yiliang Wu , Sandra J. Gardner , Ping Liu , Nan-Xing Hu
- Applicant Address: US CT Norwalk
- Assignee: Xerox Corporation
- Current Assignee: Xerox Corporation
- Current Assignee Address: US CT Norwalk
- Main IPC: B32B27/06
- IPC: B32B27/06 ; C01G33/00 ; C01B21/064 ; H01B1/04 ; C01G19/00 ; C01G31/00 ; C01G39/06 ; C01G41/00 ; B32B5/00 ; B32B3/00 ; C01B19/04 ; C01G23/00 ; B82Y30/00

Abstract:
Disclosed herein are substrates which have been dry coated with a layered material. Generally, a layered material precursor composition is mixed with a milling medium so that the milling medium is coated with the layered material. The substrate is then contacted with the coated milling medium. The layered material on the milling medium transfers to the substrate to form a coating on the substrate. In particular, conductive films can be formed on a substrate without the need for additives such as a surfactant or a polymeric binder.
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