Invention Application
US20130313225A1 CMP COMPOSITION CONTAINING ZIRCONIA PARTICLES AND METHOD OF USE
有权
包含ZIRCONIA颗粒的CMP组合物及其使用方法
- Patent Title: CMP COMPOSITION CONTAINING ZIRCONIA PARTICLES AND METHOD OF USE
- Patent Title (中): 包含ZIRCONIA颗粒的CMP组合物及其使用方法
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Application No.: US13477535Application Date: 2012-05-22
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Publication No.: US20130313225A1Publication Date: 2013-11-28
- Inventor: Wiechang Jin , John Parker , Elizabeth Remsen
- Applicant: Wiechang Jin , John Parker , Elizabeth Remsen
- Applicant Address: US IL Aurora
- Assignee: CABOT MICROELECTRONICS CORPORATION
- Current Assignee: CABOT MICROELECTRONICS CORPORATION
- Current Assignee Address: US IL Aurora
- Main IPC: C09K13/06
- IPC: C09K13/06 ; C23F1/18 ; C09K13/00 ; B44C1/22
Abstract:
The invention provides a chemical-mechanical polishing composition containing zirconia particles, a modifying agent that adheres to the zirconia particles, an organic acid, and water, as well as a method of using such a polishing composition to polish substrates and a method of using a polishing composition comprising zirconia particles, an organic acid, an oxidizing agent, and water to polishing substrates containing metal and oxide-based dielectric materials.
Public/Granted literature
- US08778212B2 CMP composition containing zirconia particles and method of use Public/Granted day:2014-07-15
Information query
