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公开(公告)号：US11384253B2
公开(公告)日：2022-07-12
申请号：US16729905
申请日：2019-12-30
发明人： Tong Li
IPC分类号： C09G1/02 , H01L21/321 , C09K13/00 , H01L21/306 , C23F1/30 , G11B5/84 , C23F3/06
摘要： The invention provides a chemical-mechanical polishing composition comprising (a) an abrasive comprising colloidal silica, (b) a compound of formula (I), (c) a compound of formula (II), (d) hydrogen peroxide, and (e) water, wherein the polishing composition has a pH of about 1 to about 5. The invention also provides a method of chemically-mechanically polishing a substrate, especially a nickel-phosphorous substrate, by contacting the substrate with the inventive chemical-mechanical polishing composition.
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公开(公告)号：US20200224057A1
公开(公告)日：2020-07-16
申请号：US16729905
申请日：2019-12-30
发明人： Tong LI
IPC分类号： C09G1/02 , H01L21/321
摘要： The invention provides a chemical-mechanical polishing composition comprising (a) an abrasive comprising colloidal silica, (b) a compound of formula (I), (c) a compound of formula (II), (d) hydrogen peroxide, and (e) water, wherein the polishing composition has a pH of about 1 to about 5. The invention also provides a method of chemically-mechanically polishing a substrate, especially a nickel-phosphorous substrate, by contacting the substrate with the inventive chemical-mechanical polishing composition.
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3.发明申请公开(公告)号：US20200056069A1
公开(公告)日：2020-02-20
申请号：US16664235
申请日：2019-10-25
发明人： Steven Grumbine , Shoutian Li , William Ward , Pankaj Singh , Jeffrey Dysard
IPC分类号： C09G1/02 , C09K3/14 , H01L21/3105 , B24B37/04
摘要： The inventive method comprises chemically-mechanically polishing a substrate with an inventive polishing composition comprising a liquid carrier and abrasive particles that have been treated with a compound.
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公开(公告)号：US10358579B2
公开(公告)日：2019-07-23
申请号：US14094921
申请日：2013-12-03
发明人： Ke Zhang , Michael White , Tsung-Ho Lee , Steven Grumbine , Hon-Wu Lau
IPC分类号： G09G1/18 , C23F3/06 , C09G1/02 , H01L21/304 , H01L21/306 , H01L21/321 , C09G1/18
摘要： Chemical mechanical polishing (CMP) compositions and methods for planarizing a nickel phosphorus (NiP) substrate are described. A NiP CMP method comprises abrading a surface of the substrate with a CMP composition. The CMP composition comprises a colloidal silica abrasive suspended in an aqueous carrier having a pH of less than 2, and containing a primary oxidizing agent comprising hydrogen peroxide, a secondary oxidizing agent comprising a metal ion capable of reversible oxidation and reduction in the presence of NiP and hydrogen peroxide, a chelating agent, and glycine. The chelating agent comprises two or three carboxylic acid substituents capable of chelating to the metal ion of the secondary oxidizing agent.
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公开(公告)号：US10294399B2
公开(公告)日：2019-05-21
申请号：US15398933
申请日：2017-01-05
发明人： Roman Ivanov , Fernando Hung Low , Cheng-Yuan Ko , Glenn Whitener
IPC分类号： H01L21/321 , C09G1/02 , C09K3/14 , H01L21/306 , H01L21/3105
摘要： The invention provides a chemical-mechanical polishing composition comprising (a) silica particles, (b) a polymer comprising sulfonic acid monomeric units, (c) optionally, a buffering agent, and (d) water, wherein the polishing composition has a pH of about 2 to about 5. The invention further provides a method of chemically-mechanically polishing a substrate with the inventive chemical-mechanical polishing composition. Typically, the substrate comprises silicon carbide and silicon nitride.
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公开(公告)号：US10293459B2
公开(公告)日：2019-05-21
申请号：US15479779
申请日：2017-04-05
发明人： Paul Andre Lefevre , William C. Allison , Alexander William Simpson , Diane Scott , Ping Huang , Leslie M. Charns , James Richard Rinehart , Robert Kerprich
摘要： Polishing pads having a polishing surface with continuous protrusions are described. Methods of fabricating polishing pads having a polishing surface with continuous protrusions are also described.
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公开(公告)号：US10066126B2
公开(公告)日：2018-09-04
申请号：US14988891
申请日：2016-01-06
发明人： Kevin P. Dockery , Helin Huang , Matthew Carnes , Glenn Whitener
IPC分类号： C09K13/00 , C09G1/02 , C09K13/06 , C09G1/04 , H01L21/321
摘要： Described are compositions (e.g., slurries) useful in methods for chemical-mechanical processing (e.g. polishing or planarizing) a surface of a substrate that contains tungsten, the slurries containing abrasive particles, metal cation catalyst, phosphorus-containing zwitterionic compound, and optional ingredients such as oxidizer; also described are methods and substrates used or processed on combination with the compositions.
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公开(公告)号：US09951054B2
公开(公告)日：2018-04-24
申请号：US12761016
申请日：2010-04-15
申请人： Shoutian Li , Robert Vacassy , Jaishankar Kasthuri
发明人： Shoutian Li , Robert Vacassy , Jaishankar Kasthuri
IPC分类号： B24B1/00 , B24D3/32 , C09K3/14 , C07D413/04 , C07D235/06 , C07D403/04 , C07D403/14 , C07D405/14 , C07D413/14 , C07D417/14 , C07D471/04
CPC分类号： C07D413/04 , C07D235/06 , C07D403/04 , C07D403/14 , C07D405/14 , C07D413/14 , C07D417/14 , C07D471/04
摘要： The invention provides a chemical-mechanical polishing pad comprising a polymeric matrix and 0.1-15 wt. % of metal oxide particles. The polymeric matrix has pores, the metal oxide particles are uniformly distributed throughout the pores, and the metal oxide particles have a specific surface area of about 25 m2/g to about 450 m2/g. The invention further provides a method of polishing a substrate with the polishing pad.
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公开(公告)号：US09931728B2
公开(公告)日：2018-04-03
申请号：US14732497
申请日：2015-06-05
发明人： William C. Allison , Diane Scott , Paul Andre Lefevre , James P. LaCasse , Alexander William Simpson
CPC分类号： B24B37/24 , B24B37/16 , B24B37/205 , B24B37/22 , B24B37/26 , B24D11/001 , B24D18/0009
摘要： Polishing pads with foundation layers and polishing surface layers are described. In an example, a polishing pad for polishing a substrate includes a foundation layer. A polishing surface layer is bonded to the foundation layer. Methods of fabricating polishing pads with a polishing surface layer bonded to a foundation layer are also described.
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公开(公告)号：US09818618B2
公开(公告)日：2017-11-14
申请号：US14700580
申请日：2015-04-30
发明人： Brian Mrzyglod , Jayakrishnan Nair , Garrett Blake
CPC分类号： H01L21/30625 , B24B37/042 , B24B37/22 , B24B37/24 , B24D11/00 , B24D11/001 , B24D18/0045
摘要： The invention is directed to a multi-layer polishing pad for chemical-mechanical polishing comprising a top layer, a middle layer and a bottom layer, wherein the top layer and bottom layer are joined together by the middle layer, and without the use of an adhesive. The invention is also directed to a multi-layer polishing pad comprising an optically transmissive region, wherein the layers of the multi-layer polishing pad are joined together without the use of an adhesive.
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