Invention Application
- Patent Title: SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, FLUID SUPPLYING METHOD AND STORAGE MEDIUM
- Patent Title (中): 基板处理装置，基板处理方法，流体供应方法和储存介质
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Application No.: US13910270Application Date: 2013-06-05
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Publication No.: US20130333726A1Publication Date: 2013-12-19
- Inventor: Gentaro GOSHI , Kazuyuki MITSUOKA , Gen YOU , Hiroki OHNO , Takehiko ORII , Takayuki TOSHIMA
- Applicant: Tokyo Electron Limited
- Priority: JP2012-131031 20120608; JP2012-158932 20120717
- Main IPC: B08B3/10
- IPC: B08B3/10
Abstract:
The present disclosure provides a substrate processing apparatus including: a processing chamber configured to process a substrate; a fluid supply source configured to supply a substrate processing fluid used in processing for the substrate in a predetermined pressure; a constant pressure supplying path configured to supply the substrate processing fluid from the fluid supply source to the processing chamber in a predetermined pressure without boosting the pressure of the substrate processing liquid; a boosted pressure supplying path configured to boost the pressure of the substrate processing fluid from the fluid supply source into a predetermined pressure by a booster mechanism and supply the pressure boosted substrate processing fluid to the processing chamber; and a control unit configured to switch over the constant pressure supplying path and the boosted pressure supplying path.
Public/Granted literature
- US09662685B2 Substrate processing apparatus, substrate processing method, fluid supplying method and storage medium Public/Granted day:2017-05-30
Information query
IPC分类:
