发明申请
- 专利标题： Bonding Package components Through Plating
- 专利标题（中）： 通过电镀接合封装组件
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申请号： US13527422申请日： 2012-06-19
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公开(公告)号： US20130334692A1公开(公告)日： 2013-12-19
- 发明人: Zheng-Yi Lim , Yi-Wen Wu , Tzong-Hann Yang , Ming-Che Ho , Chung-Shi Liu
- 申请人： Zheng-Yi Lim , Yi-Wen Wu , Tzong-Hann Yang , Ming-Che Ho , Chung-Shi Liu
- 申请人地址： TW Hsin-Chu
- 专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人地址： TW Hsin-Chu
- 主分类号： B23K31/02
- IPC分类号： B23K31/02 ; H01L23/488
摘要：
A method includes aligning a first electrical connector of a first package component to a second electrical connector of a second package component. With the first electrical connector aligned to the second electrical connector, a metal layer is plated on the first and the second electrical connectors. The metal layer bonds the first electrical connector to the second electrical connector.
公开/授权文献
- US09117772B2 Bonding package components through plating 公开/授权日：2015-08-25
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