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公开(公告)号：US20130334692A1
公开(公告)日：2013-12-19
申请号：US13527422
申请日：2012-06-19
申请人： Zheng-Yi Lim , Yi-Wen Wu , Tzong-Hann Yang , Ming-Che Ho , Chung-Shi Liu
发明人： Zheng-Yi Lim , Yi-Wen Wu , Tzong-Hann Yang , Ming-Che Ho , Chung-Shi Liu
IPC分类号： B23K31/02 , H01L23/488
CPC分类号： H01L24/81 , H01L21/56 , H01L23/3107 , H01L23/3128 , H01L23/49811 , H01L23/49816 , H01L23/49833 , H01L24/05 , H01L24/13 , H01L24/16 , H01L24/17 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2224/0401 , H01L2224/13016 , H01L2224/13017 , H01L2224/13018 , H01L2224/13023 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/13582 , H01L2224/13583 , H01L2224/13611 , H01L2224/13644 , H01L2224/13647 , H01L2224/13655 , H01L2224/13657 , H01L2224/13664 , H01L2224/16148 , H01L2224/16225 , H01L2224/16238 , H01L2224/16501 , H01L2224/16505 , H01L2224/32135 , H01L2224/32141 , H01L2224/32145 , H01L2224/81085 , H01L2224/811 , H01L2224/8112 , H01L2224/81121 , H01L2224/81193 , H01L2224/81232 , H01L2224/81355 , H01L2224/81359 , H01L2224/81801 , H01L2224/8192 , H01L2225/06513 , H01L2225/06517 , H01L2225/0652 , H01L2225/1023 , H01L2225/1058 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/15311 , H01L2924/1533 , H01L2924/15331 , H01L2924/181 , H01L2924/1815 , H01L2924/18161 , H01L2924/3841 , H01L2924/00014 , H01L2924/00012 , H01L2924/01005 , H01L2924/01074 , H01L2924/01015 , H01L2924/06 , H01L2924/00
摘要： A method includes aligning a first electrical connector of a first package component to a second electrical connector of a second package component. With the first electrical connector aligned to the second electrical connector, a metal layer is plated on the first and the second electrical connectors. The metal layer bonds the first electrical connector to the second electrical connector.
摘要翻译： 一种方法包括将第一包装部件的第一电连接器与第二包装部件的第二电连接器对准。 利用第一电连接器与第二电连接器对准，金属层被电镀在第一和第二电连接器上。 金属层将第一电连接器连接到第二电连接器。
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公开(公告)号：US09117772B2
公开(公告)日：2015-08-25
申请号：US13527422
申请日：2012-06-19
申请人： Zheng-Yi Lim , Yi-Wen Wu , Tzong-Hann Yang , Ming-Che Ho , Chung-Shi Liu
发明人： Zheng-Yi Lim , Yi-Wen Wu , Tzong-Hann Yang , Ming-Che Ho , Chung-Shi Liu
IPC分类号： H01L21/44 , H01L23/31 , H01L25/10 , H01L25/00 , H01L25/065 , H01L21/56 , H01L23/498 , H01L23/00
CPC分类号： H01L24/81 , H01L21/56 , H01L23/3107 , H01L23/3128 , H01L23/49811 , H01L23/49816 , H01L23/49833 , H01L24/05 , H01L24/13 , H01L24/16 , H01L24/17 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2224/0401 , H01L2224/13016 , H01L2224/13017 , H01L2224/13018 , H01L2224/13023 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/13582 , H01L2224/13583 , H01L2224/13611 , H01L2224/13644 , H01L2224/13647 , H01L2224/13655 , H01L2224/13657 , H01L2224/13664 , H01L2224/16148 , H01L2224/16225 , H01L2224/16238 , H01L2224/16501 , H01L2224/16505 , H01L2224/32135 , H01L2224/32141 , H01L2224/32145 , H01L2224/81085 , H01L2224/811 , H01L2224/8112 , H01L2224/81121 , H01L2224/81193 , H01L2224/81232 , H01L2224/81355 , H01L2224/81359 , H01L2224/81801 , H01L2224/8192 , H01L2225/06513 , H01L2225/06517 , H01L2225/0652 , H01L2225/1023 , H01L2225/1058 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/15311 , H01L2924/1533 , H01L2924/15331 , H01L2924/181 , H01L2924/1815 , H01L2924/18161 , H01L2924/3841 , H01L2924/00014 , H01L2924/00012 , H01L2924/01005 , H01L2924/01074 , H01L2924/01015 , H01L2924/06 , H01L2924/00
摘要： A method includes aligning a first electrical connector of a first package component to a second electrical connector of a second package component. With the first electrical connector aligned to the second electrical connector, a metal layer is plated on the first and the second electrical connectors. The metal layer bonds the first electrical connector to the second electrical connector.
摘要翻译： 一种方法包括将第一包装部件的第一电连接器与第二包装部件的第二电连接器对准。 利用第一电连接器与第二电连接器对准，金属层被电镀在第一和第二电连接器上。 金属层将第一电连接器连接到第二电连接器。
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公开(公告)号：US20120322255A1
公开(公告)日：2012-12-20
申请号：US13161303
申请日：2011-06-15
申请人： Ming-Da Cheng , Chih-Wei Lin , Hsiu-Jen Lin , Tzong-Hann Yang , Wen-Hsiung Lu , Zheng-Yi Lim , Yi-Wen Wu , Chung-Shi Liu
发明人： Ming-Da Cheng , Chih-Wei Lin , Hsiu-Jen Lin , Tzong-Hann Yang , Wen-Hsiung Lu , Zheng-Yi Lim , Yi-Wen Wu , Chung-Shi Liu
IPC分类号： H01L21/768
CPC分类号： H01L24/11 , H01L21/6836 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2221/68327 , H01L2224/11003 , H01L2224/111 , H01L2224/1133 , H01L2224/11462 , H01L2224/1147 , H01L2224/11825 , H01L2224/11849 , H01L2224/119 , H01L2224/13022 , H01L2224/13082 , H01L2224/13111 , H01L2224/13139 , H01L2224/13147 , H01L2224/13155 , H01L2224/1357 , H01L2224/13655 , H01L2224/13671 , H01L2224/13672 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/81193 , H01L2224/94 , H01L2224/97 , H01L2924/00014 , H01L2924/00012 , H01L2924/01029 , H01L2924/01083 , H01L2924/0103 , H01L2924/01047 , H01L2924/01082 , H01L2224/11
摘要： A system and method for forming metal bumps is provided. An embodiment comprises attaching conductive material to a carrier medium and then contacting the conductive material to conductive regions of a substrate. Portions of the conductive material are then bonded to the conductive regions using a bonding process to form conductive caps on the conductive regions, and residual conductive material and the carrier medium are removed. A reflow process is used to reflow the conductive caps into conductive bumps.
摘要翻译： 提供一种用于形成金属凸块的系统和方法。 一个实施例包括将导电材料附着到载体介质上，然后将导电材料接触到基底的导电区域。 然后使用接合工艺将导电材料的部分结合到导电区域，以在导电区域上形成导电盖，并且去除残留的导电材料和载体介质。 回流工艺用于将导电盖重新流到导电凸块中。
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公开(公告)号：US08501615B2
公开(公告)日：2013-08-06
申请号：US13161303
申请日：2011-06-15
申请人： Ming-Da Cheng , Chih-Wei Lin , Hsiu-Jen Lin , Tzong-Hann Yang , Wen-Hsiung Lu , Zheng-Yi Lim , Yi-Wen Wu , Chung-Shi Liu
发明人： Ming-Da Cheng , Chih-Wei Lin , Hsiu-Jen Lin , Tzong-Hann Yang , Wen-Hsiung Lu , Zheng-Yi Lim , Yi-Wen Wu , Chung-Shi Liu
IPC分类号： H01L21/44
CPC分类号： H01L24/11 , H01L21/6836 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2221/68327 , H01L2224/11003 , H01L2224/111 , H01L2224/1133 , H01L2224/11462 , H01L2224/1147 , H01L2224/11825 , H01L2224/11849 , H01L2224/119 , H01L2224/13022 , H01L2224/13082 , H01L2224/13111 , H01L2224/13139 , H01L2224/13147 , H01L2224/13155 , H01L2224/1357 , H01L2224/13655 , H01L2224/13671 , H01L2224/13672 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/81193 , H01L2224/94 , H01L2224/97 , H01L2924/00014 , H01L2924/00012 , H01L2924/01029 , H01L2924/01083 , H01L2924/0103 , H01L2924/01047 , H01L2924/01082 , H01L2224/11
摘要： A system and method for forming metal bumps is provided. An embodiment comprises attaching conductive material to a carrier medium and then contacting the conductive material to conductive regions of a substrate. Portions of the conductive material are then bonded to the conductive regions using a bonding process to form conductive caps on the conductive regions, and residual conductive material and the carrier medium are removed. A reflow process is used to reflow the conductive caps into conductive bumps.
摘要翻译： 提供一种用于形成金属凸块的系统和方法。 一个实施例包括将导电材料附着到载体介质上，然后将导电材料接触到基底的导电区域。 然后使用接合工艺将导电材料的部分结合到导电区域，以在导电区域上形成导电盖，并且去除残留的导电材料和载体介质。 回流工艺用于将导电盖重新流到导电凸块中。
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公开(公告)号：US20130127059A1
公开(公告)日：2013-05-23
申请号：US13299100
申请日：2011-11-17
申请人： Chih-Wei Lai , Ming-Che Ho , Tzong-Hann Yang , Chien Rhone Wang , Chia-Tung Chang , Hung-Jui Kuo , Chung-Shi Liu
发明人： Chih-Wei Lai , Ming-Che Ho , Tzong-Hann Yang , Chien Rhone Wang , Chia-Tung Chang , Hung-Jui Kuo , Chung-Shi Liu
CPC分类号： G06F17/5077 , G06F17/5072 , H01L23/488 , H01L24/11 , H01L24/13 , H01L24/14 , H01L2224/034 , H01L2224/03912 , H01L2224/0401 , H01L2224/05016 , H01L2224/05124 , H01L2224/05144 , H01L2224/05147 , H01L2224/05552 , H01L2224/05572 , H01L2224/05666 , H01L2224/11462 , H01L2224/11464 , H01L2224/1147 , H01L2224/11849 , H01L2224/13006 , H01L2224/13012 , H01L2224/13014 , H01L2224/13083 , H01L2224/13111 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/1403 , H01L2224/14132 , H01L2924/00014 , H01L2924/00012 , H01L2924/01047 , H01L2924/01029
摘要： A device includes a plurality of connectors on a top surface of a package component. The plurality of connectors includes a first connector having a first lateral dimension, and a second connector having a second lateral dimension. The second lateral dimension is greater than the first lateral dimension. The first and the second lateral dimensions are measured in directions parallel to a major surface of the package component.
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公开(公告)号：US08791579B2
公开(公告)日：2014-07-29
申请号：US13299100
申请日：2011-11-17
申请人： Chih-Wei Lai , Ming-Che Ho , Tzong-Hann Yang , Chien Rhone Wang , Chia-Tung Chang , Hung-Jui Kuo , Chung-Shi Liu
发明人： Chih-Wei Lai , Ming-Che Ho , Tzong-Hann Yang , Chien Rhone Wang , Chia-Tung Chang , Hung-Jui Kuo , Chung-Shi Liu
IPC分类号： H01L23/52 , H01L23/48 , H01L23/485 , H01L23/495
CPC分类号： G06F17/5077 , G06F17/5072 , H01L23/488 , H01L24/11 , H01L24/13 , H01L24/14 , H01L2224/034 , H01L2224/03912 , H01L2224/0401 , H01L2224/05016 , H01L2224/05124 , H01L2224/05144 , H01L2224/05147 , H01L2224/05552 , H01L2224/05572 , H01L2224/05666 , H01L2224/11462 , H01L2224/11464 , H01L2224/1147 , H01L2224/11849 , H01L2224/13006 , H01L2224/13012 , H01L2224/13014 , H01L2224/13083 , H01L2224/13111 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/1403 , H01L2224/14132 , H01L2924/00014 , H01L2924/00012 , H01L2924/01047 , H01L2924/01029
摘要： A device includes a plurality of connectors on a top surface of a package component. The plurality of connectors includes a first connector having a first lateral dimension, and a second connector having a second lateral dimension. The second lateral dimension is greater than the first lateral dimension. The first and the second lateral dimensions are measured in directions parallel to a major surface of the package component.
摘要翻译： 一种装置包括在包装部件的顶表面上的多个连接器。 多个连接器包括具有第一横向尺寸的第一连接器和具有第二横向尺寸的第二连接器。 第二横向尺寸大于第一横向尺寸。 第一和第二横向尺寸在平行于包装部件的主表面的方向上测量。
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