发明申请
- 专利标题： REDISTRIBUTION LAYER (RDL) WITH VARIABLE OFFSET BUMPS
- 专利标题（中）： 重新分配层（RDL），具有可变的偏移量
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申请号： US13553882申请日： 2012-07-20
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公开(公告)号： US20140021600A1公开(公告)日： 2014-01-23
- 发明人: Timothy H. Daubenspeck , Brian M. Erwin , Jeffrey P. Gambino , Wolfgang Sauter , George J. Scott
- 申请人： Timothy H. Daubenspeck , Brian M. Erwin , Jeffrey P. Gambino , Wolfgang Sauter , George J. Scott
- 申请人地址： US NY Armonk
- 专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址： US NY Armonk
- 主分类号： H01L23/488
- IPC分类号： H01L23/488 ; H01L21/768
摘要：
An integrated circuit (IC) chip is disclosed including a plurality of metal vertical interconnect accesses (vias) in a back end of line (BEOL) layer, a redistribution layer (RDL) on the BEOL layer, the BEOL layer having a plurality of bond pads, each bond pad connected to at least one corresponding metal via through the RDL; and a solder bump connected to each bond pad, wherein each solder bump is laterally offset from the corresponding metal via connected to the bond pad towards a center of the IC chip by an offset distance, wherein the offset distance is non-uniform across the IC chip. In one embodiment, the offset distance for each solder bump is proportionate to a distance between the center of the IC chip and the center of the corresponding solder bump pad structure for that solder bump.
公开/授权文献
- US08710656B2 Redistribution layer (RDL) with variable offset bumps 公开/授权日：2014-04-29
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