A heat dissipating structure is provided and it covers a printed circuit board (PCB) including at least one interface card slot. The heat dissipating structure includes a board, at least one heat sink and at least one interface card opening. The board has a first surface and a second surface which are opposite to each other. The second surface of the board faces the PCB. The heat sink is formed at the first surface of the board. The interface card opening penetrates through the first surface and the second surface of the board, so as to make the interface card slot exposed in the interface card opening.