公开(公告)号：US20140104770A1

公开(公告)日：2014-04-17

申请号：US14022248

申请日：2013-09-10

Applicant: ASUSTeK Computer Inc.

Inventor： Ming-Fang TSAI ,  Ching HO ,  Yen-Chao HUANG ,  Chen-Hsuan MA

IPC: G06F1/20

CPC classification number: G06F1/20 ,  G06F2200/201

Abstract: A heat dissipating structure is provided and it covers a printed circuit board (PCB) including at least one interface card slot. The heat dissipating structure includes a board, at least one heat sink and at least one interface card opening. The board has a first surface and a second surface which are opposite to each other. The second surface of the board faces the PCB. The heat sink is formed at the first surface of the board. The interface card opening penetrates through the first surface and the second surface of the board, so as to make the interface card slot exposed in the interface card opening.

Abstract translation: 提供散热结构，并且其覆盖包括至少一个接口卡槽的印刷电路板（PCB）。 散热结构包括板，至少一个散热器和至少一个接口卡开口。 板具有彼此相对的第一表面和第二表面。 电路板的第二个表面面向PCB。 散热片形成在板的第一表面。 接口卡开口穿过板的第一表面和第二表面，以使接口卡槽暴露在接口卡开口中。

公开(公告)号：US20190387640A1

公开(公告)日：2019-12-19

申请号：US16429247

申请日：2019-06-03

Applicant: ASUSTeK COMPUTER INC.

Inventor： Chen-Hsuan MA ,  Ching HO ,  Yu-Chen LEE

IPC: H05K7/20 ,  G06F1/20 ,  G06F1/16

Abstract: A heat dissipation device includes a housing and a fan. The housing includes a base and a plurality of fins. The fins are connected to the base and are arranged sequentially along a direction. The plurality of fins each have an opening, and the openings are communicated to form a space. The fan is disposed inside the space and is configured to rotate about an axis parallel to the direction.

公开(公告)号：US20140110090A1

公开(公告)日：2014-04-24

申请号：US14051463

申请日：2013-10-11

Applicant: ASUSTeK COMPUTER INC.

Inventor： Chen-Hsuan MA ,  Ing-Jer CHIOU

IPC: F28F3/02

CPC classification number: F28F3/02 ,  F28D15/0275 ,  F28F27/02 ,  F28F2250/00 ,  H01L23/3672 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A heat dissipation device is provided. The heat dissipation device is applied to an electronic device with a first heat source and a second heat source. The heat dissipation device includes a housing, an impeller, a first heat conductive assembly, a second heat conductive assembly and an switch. The housing includes an accommodating space, a first outlet and a second outlet. The first outlet and the second outlet are connected to and through the accommodating space. The impeller is disposed in the accommodating space. The first heat conductive assembly is connected to the first outlet and the first heat source. The second heat conductive assembly is connected to the second outlet and the second heat source. The switch is disposed at the first outlet to open or dose the first outlet.

Abstract translation: 提供散热装置。 散热装置应用于具有第一热源和第二热源的电子装置。 散热装置包括壳体，叶轮，第一导热组件，第二导热组件和开关。 壳体包括容纳空间，第一出口和第二出口。 第一出口和第二出口连接并通过容纳空间。 叶轮设置在容纳空间中。 第一导热组件连接到第一出口和第一热源。 第二导热组件连接到第二出口和第二热源。 开关设置在第一出口处以打开或剂量第一出口。