公开(公告)号：US20140104770A1

公开(公告)日：2014-04-17

申请号：US14022248

申请日：2013-09-10

Applicant: ASUSTeK Computer Inc.

Inventor： Ming-Fang TSAI ,  Ching HO ,  Yen-Chao HUANG ,  Chen-Hsuan MA

IPC: G06F1/20

CPC classification number: G06F1/20 ,  G06F2200/201

Abstract: A heat dissipating structure is provided and it covers a printed circuit board (PCB) including at least one interface card slot. The heat dissipating structure includes a board, at least one heat sink and at least one interface card opening. The board has a first surface and a second surface which are opposite to each other. The second surface of the board faces the PCB. The heat sink is formed at the first surface of the board. The interface card opening penetrates through the first surface and the second surface of the board, so as to make the interface card slot exposed in the interface card opening.

Abstract translation: 提供散热结构，并且其覆盖包括至少一个接口卡槽的印刷电路板（PCB）。 散热结构包括板，至少一个散热器和至少一个接口卡开口。 板具有彼此相对的第一表面和第二表面。 电路板的第二个表面面向PCB。 散热片形成在板的第一表面。 接口卡开口穿过板的第一表面和第二表面，以使接口卡槽暴露在接口卡开口中。