公开(公告)号：US20190387640A1

公开(公告)日：2019-12-19

申请号：US16429247

申请日：2019-06-03

Applicant: ASUSTeK COMPUTER INC.

Inventor： Chen-Hsuan MA ,  Ching HO ,  Yu-Chen LEE

IPC: H05K7/20 ,  G06F1/20 ,  G06F1/16

Abstract: A heat dissipation device includes a housing and a fan. The housing includes a base and a plurality of fins. The fins are connected to the base and are arranged sequentially along a direction. The plurality of fins each have an opening, and the openings are communicated to form a space. The fan is disposed inside the space and is configured to rotate about an axis parallel to the direction.

公开(公告)号：US20130206367A1

公开(公告)日：2013-08-15

申请号：US13763164

申请日：2013-02-08

Applicant: ASUSTEK COMPUTER INC.

Inventor： Meng-Ping CHEN ,  Ching HO

IPC: F28F3/02

CPC classification number: F28F3/02 ,  F28D15/0275 ,  F28F1/12 ,  H01L23/467 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A heat dissipating module includes a base, at least one thermal conductive element, at least one liquid-pipe and a heat sink. The thermal conductive element is disposed at the base. The liquid-pipe is disposed adjacent to the thermal conductive element. The liquid-pipe is disposed at the base. The heat sink covers the thermal conductive element and the liquid-pipe. A part of the heat sink is connected to the base. The heat sink includes a plurality of fins. The heat dissipating module combines air-cooling with water-cooling so as to enhance thermal conductivity.

Abstract translation: 散热模块包括基座，至少一个导热元件，至少一个液体管和散热器。 导热元件设置在基座上。 液体管与导热元件相邻设置。 液体管设置在基部。 散热器覆盖导热元件和液体管。 散热器的一部分连接到基座。 散热片包括多个散热片。 散热模块将空气冷却与水冷结合在一起，以提高导热性。

公开(公告)号：US20140104770A1

公开(公告)日：2014-04-17

申请号：US14022248

申请日：2013-09-10

Applicant: ASUSTeK Computer Inc.

Inventor： Ming-Fang TSAI ,  Ching HO ,  Yen-Chao HUANG ,  Chen-Hsuan MA

IPC: G06F1/20

CPC classification number: G06F1/20 ,  G06F2200/201

Abstract: A heat dissipating structure is provided and it covers a printed circuit board (PCB) including at least one interface card slot. The heat dissipating structure includes a board, at least one heat sink and at least one interface card opening. The board has a first surface and a second surface which are opposite to each other. The second surface of the board faces the PCB. The heat sink is formed at the first surface of the board. The interface card opening penetrates through the first surface and the second surface of the board, so as to make the interface card slot exposed in the interface card opening.

Abstract translation: 提供散热结构，并且其覆盖包括至少一个接口卡槽的印刷电路板（PCB）。 散热结构包括板，至少一个散热器和至少一个接口卡开口。 板具有彼此相对的第一表面和第二表面。 电路板的第二个表面面向PCB。 散热片形成在板的第一表面。 接口卡开口穿过板的第一表面和第二表面，以使接口卡槽暴露在接口卡开口中。