发明申请
- 专利标题： CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- 专利标题（中）： 芯片包装及其形成方法
-
申请号： US14339360申请日： 2014-07-23
-
公开(公告)号： US20140332908A1公开(公告)日： 2014-11-13
- 发明人: Yen-Shih HO , Tsang-Yu LIU , Shu-Ming CHANG , Yu-Lung HUANG , Chao-Yen LIN , Wei-Luen SUEN , Chien-Hui CHEN , Ho-Yin YIU
- 申请人： XINTEC INC.
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L21/56 ; H01L21/768 ; H01L23/00 ; H01L23/31
摘要：
A chip package including a chip is provided. The chip includes a sensing region or device region adjacent to an upper surface of the chip. A sensing array is located in the sensing region or device region and includes a plurality of sensing units. A plurality of first openings is located in the chip and correspondingly exposes the sensing units. A plurality of conductive extending portions is disposed in the first openings and is electrically connected to the sensing units, wherein the conductive extending portions extend from the first openings onto the upper surface of the chip. A method for forming the chip package is also provided.
公开/授权文献
- US09437478B2 Chip package and method for forming the same 公开/授权日：2016-09-06
信息查询
IPC分类:
