Invention Application
- Patent Title: HIGH ELECTRON MOBILITY TRANSISTORS AND METHODS OF FABRICATING THE SAME
- Patent Title (中): 高电子移动晶体管及其制造方法
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Application No.: US14497585Application Date: 2014-09-26
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Publication No.: US20150008485A1Publication Date: 2015-01-08
- Inventor: In-jun HWANG , Jai-kwang SHIN , Jae-joon OH , Jong-seob KIM , Hyuk-soon CHOI , Ki-ha HONG
- Applicant: Samsung Electronics Co., Ltd.
- Priority: KR10-2010-0056192 20100614
- Main IPC: H01L29/778
- IPC: H01L29/778 ; H01L29/66 ; H01L29/08 ; H01L29/10

Abstract:
A High electron mobility transistor (HEMT) includes a source electrode, a gate electrode, a drain electrode, a channel forming layer in which a two-dimensional electron gas (2DEG) channel is induced, and a channel supplying layer for inducing the 2DEG channel in the channel forming layer. The source electrode and the drain electrode are located on the channel supplying layer. A channel increase layer is between the channel supplying layer and the source and drain electrodes. A thickness of the channel supplying layer is less than about 15 nm.
Public/Granted literature
- US09859410B2 High electron mobility transistors and methods of fabricating the same Public/Granted day:2018-01-02
Information query
IPC分类: