Invention Application
US20150216044A1 CHIP PARTS AND METHOD FOR MANUFACTURING THE SAME, CIRCUIT ASSEMBLY HAVING THE CHIP PARTS AND ELECTRONIC DEVICE
审中-公开
芯片部件及其制造方法，具有芯片部件和电子器件的电路组件
- Patent Title: CHIP PARTS AND METHOD FOR MANUFACTURING THE SAME, CIRCUIT ASSEMBLY HAVING THE CHIP PARTS AND ELECTRONIC DEVICE
- Patent Title (中): 芯片部件及其制造方法，具有芯片部件和电子器件的电路组件
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Application No.: US14581460Application Date: 2014-12-23
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Publication No.: US20150216044A1Publication Date: 2015-07-30
- Inventor: Hiroshi TAMAGAWA , Yasuhiro KONDO , Hiroki YAMAMOTO
- Applicant: ROHM CO., LTD.
- Applicant Address: JP Kyoto
- Assignee: ROHM CO., LTD.
- Current Assignee: ROHM CO., LTD.
- Current Assignee Address: JP Kyoto
- Priority: JP2013-272825 20131227; JP2013-272826 20131227; JP2014-225234 20141105
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K3/00 ; H05K1/09 ; H05K5/00 ; H05K1/11
Abstract:
The chip part of the present invention includes a substrate, an electrode on the substrate and having a front surface in which a plurality of recessed portions are formed toward the thickness direction thereof, and an element region having a circuit element that is electrically connected to the electrode.
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