Invention Application
US20150239069A1 SOLDER PASTE, JOINING METHOD USING THE SAME AND JOINED STRUCTURE
审中-公开
焊膏，使用相同方式和接合结构的接合方法
- Patent Title: SOLDER PASTE, JOINING METHOD USING THE SAME AND JOINED STRUCTURE
- Patent Title (中): 焊膏，使用相同方式和接合结构的接合方法
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Application No.: US14697717Application Date: 2015-04-28
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Publication No.: US20150239069A1Publication Date: 2015-08-27
- Inventor: Kosuke Nakano , Hidekiyo Takaoka
- Applicant: Murata Manufacturing Co., Ltd.
- Priority: JP2009-203611 20090903
- Main IPC: B23K35/02
- IPC: B23K35/02 ; B23K1/00 ; B23K35/362 ; B23K35/26 ; B23K35/36
Abstract:
A solder paste including a metal component consisting of a first metal powder and a second metal powder having a melting point higher than that of the first metal, and a flux component. The first metal is Sn or an alloy containing Sn, the second metal is one of (1) a Cu—Mn alloy in which a ratio of Mn to the second metal is 5 to 30% by weight and (2) a Cu—Ni alloy in which a ratio of Ni to the second metal is 5 to 20% by weight, and a ratio of the second metal to the metal component is 36.9% by volume or greater.
Public/Granted literature
- US10010980B2 Solder paste, joining method using the same and joined structure Public/Granted day:2018-07-03
Information query
