Invention Application
- Patent Title: LASER MACHINING DEVICE AND LASER MACHINING METHOD
- Patent Title (中): 激光加工设备和激光加工方法
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Application No.: US14778621Application Date: 2014-03-13
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Publication No.: US20160052084A1Publication Date: 2016-02-25
- Inventor: Daisuke KAWAGUCHI , Makoto NAKANO , Ryota SUGIO , Tsubasa HIROSE , Keisuke ARAKI
- Applicant: HAMAMATSU PHOTONICS K.K.
- Applicant Address: JP Hamamatsu-shi, Shizuoka
- Assignee: HAMAMATSU PHOTONICS K.K.
- Current Assignee: HAMAMATSU PHOTONICS K.K.
- Current Assignee Address: JP Hamamatsu-shi, Shizuoka
- Priority: JP2013-065978 20130327; JP2013-065987 20130327; JP2013-065990 20130327
- International Application: PCT/JP2014/056726 WO 20140313
- Main IPC: B23K26/00
- IPC: B23K26/00 ; B23K26/06 ; B23K26/53 ; B23K26/064

Abstract:
The laser processing device comprises a laser light source emitting a laser light, a converging optical system converging the laser light at an object to be processed, and an aberration providing part for imparting an aberration to the laser light converged at the object by the converging optical system. In an optical axis direction of the laser light, letting a reference aberration range be a range of a converging-induced aberration as an aberration occurring at a position where the laser light is converged as a result of converging the laser light at the object, the aberration providing part imparts a first aberration to the laser light such that the laser light has an elongated range longer than the reference aberration range in the optical axis direction as an aberration range and an intensity distribution in the optical axis direction with a continuous undulation in the elongated range.
Public/Granted literature
- US10124439B2 Laser machining device and laser machining method Public/Granted day:2018-11-13
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