Invention Application
US20160085219A1 SCHEDULING APPLICATIONS IN PROCESSING DEVICES BASED ON PREDICTED THERMAL IMPACT
审中-公开
基于预测热影响的处理设备中的调度应用
- Patent Title: SCHEDULING APPLICATIONS IN PROCESSING DEVICES BASED ON PREDICTED THERMAL IMPACT
- Patent Title (中): 基于预测热影响的处理设备中的调度应用
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Application No.: US14493189Application Date: 2014-09-22
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Publication No.: US20160085219A1Publication Date: 2016-03-24
- Inventor: Indrani Paul , Manish Arora , Yasuko Eckert , Srilatha Manne
- Applicant: Advanced Micro Devices, Inc.
- Main IPC: G05B15/02
- IPC: G05B15/02 ; G06N5/04
Abstract:
A processing device includes a plurality of components and a system management unit to selectively schedule an application phase to one of the plurality of components based on one or more comparisons of predictions of a plurality of thermal impacts of executing the application phase on each of the plurality of components. The predictions may be generated based on a thermal history associated with the application phase, thermal sensitivities of the plurality of components, or a layout of the plurality of components in the processing device.
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