Invention Application
- Patent Title: SUBSTRATE LIQUID PROCESSING APPARATUS
- Patent Title (中): 基板液体加工设备
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Application No.: US14922441Application Date: 2015-10-26
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Publication No.: US20160114345A1Publication Date: 2016-04-28
- Inventor: Shouta Umezaki , Yoshihiro Kai , Kazuki Kosai , Mitsuo Tanaka
- Applicant: Tokyo Electron Limited
- Priority: JP2014-219315 20141028
- Main IPC: B05B13/02
- IPC: B05B13/02 ; B05B1/00

Abstract:
Disclosed is a substrate liquid processing apparatus. The apparatus includes: a substrate holding unit configured to hold a substrate horizontally; a nozzle configured to eject a processing liquid in a transversal direction toward a liquid arrival target position set on the substrate held by the substrate holding unit from an ejection port which is located at an injection position spaced away from the liquid arrival target position by a predetermined distance horizontally; and a liquid receiving unit provided below the nozzle to receive the processing liquid dropping from the ejection port of the nozzle.
Public/Granted literature
- US09842751B2 Substrate liquid processing apparatus Public/Granted day:2017-12-12
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