发明申请
- 专利标题： Minimal Contact Wet Processing Systems and Methods
- 专利标题（中）： 最小接触湿处理系统和方法
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申请号： US14525944申请日： 2014-10-28
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公开(公告)号： US20160118309A1公开(公告)日： 2016-04-28
- 发明人: Rajesh Kelekar , Satbir Kahlon , Robert Sculac
- 申请人： Intermolecular, Inc.
- 主分类号： H01L21/66
- IPC分类号： H01L21/66 ; H01L21/288 ; H01L21/67 ; H01L21/311 ; H01L21/3213 ; H01L21/02 ; H01L21/306
摘要：
Embodiments provided herein describe systems and methods for processing substrates. A substrate having a first region and a second region is provided. A container is positioned proximate to the first region of the substrate. The container has an opening on an end thereof adjacent to the substrate. A processing liquid is dispensed into the container such that the processing liquid contacts the first region of the substrate through the opening. The gaseous pressure in a portion of the container devoid of the processing liquid is reduced. The reduction of the gaseous pressure prevents the processing liquid from flowing from the first region of the substrate to the second region of the substrate.
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