Method and System for Improving Performance and Preventing Corrosion in Multi-Module Cleaning Chamber
    1.
    发明申请
    Method and System for Improving Performance and Preventing Corrosion in Multi-Module Cleaning Chamber 审中-公开
    提高性能和防止多模清洗室腐蚀的方法和系统

    公开(公告)号:US20140102488A1

    公开(公告)日:2014-04-17

    申请号:US14102830

    申请日:2013-12-11

    IPC分类号: H01L21/67 B08B3/10

    摘要: A method and system for cleaning a substrate in a multi-module cleaning assembly is provided. The method begins by receiving the substrate into the cleaning module. A cleaning chemistry, at a temperature elevated from an ambient temperature, is applied onto a top surface of the substrate. Concurrent with application of the cleaning chemistry, vapors are exhausted from the cleaning chemistry through a port located below a bottom surface of the substrate with the vapor exhaustion providing a negative pressure relative to a pressure external to the cleaning module. The application of the cleaning chemistry is terminated, followed by termination of the exhausting of the vapors. The substrate is dried after the flowing of inert gas is terminated.

    摘要翻译: 提供了一种用于在多模块清洁组件中清洁基板的方法和系统。 该方法通过将衬底接收到清洁模块中开始。 在从环境温度升高的温度下的清洁化学品被施加到基底的顶表面上。 与清洁化学品的应用同时,蒸汽通过位于基底底表面下方的端口从清洁化学品中排出,蒸汽耗尽相对于清洁模块外部的压力提供负压。 终止清洁化学品的应用,然后终止蒸气排气。 在终止惰性气体的流动之后干燥基材。

    Systems and Methods for Wet Processing Substrates with Rotating Splash Shield
    4.
    发明申请
    Systems and Methods for Wet Processing Substrates with Rotating Splash Shield 审中-公开
    湿法处理衬底与旋转防溅罩的系统和方法

    公开(公告)号:US20160111302A1

    公开(公告)日:2016-04-21

    申请号:US14519363

    申请日:2014-10-21

    摘要: Embodiments provided herein provide systems and methods for wet processing substrates with a rotating splash shield. The systems include a fluid dispenser configured to dispense a processing fluid. A substrate support configured to support and rotate a substrate is also included. The substrate support is disposed such that the processing fluid dispensed by the fluid dispenser flows onto the substrate. A splash shield is positioned on at least one side of the substrate support and is configured to rotate. The splash shield has an upper portion extending above an upper surface of the substrate and a lower portion extending below a lower surface of the substrate.

    摘要翻译: 本文提供的实施例提供了用于湿处理具有旋转防溅罩的基板的系统和方法。 该系统包括配置成分配处理流体的流体分配器。 还包括构造成支撑和旋转衬底的衬底支撑件。 衬底支撑件设置成使得由流体分配器分配的处理流体流到衬底上。 防溅罩位于基板支撑件的至少一侧上并且被构造成旋转。 防溅罩具有在基板的上表面上方延伸的上部和在基板的下表面下方延伸的下部。

    High dilution ratio by successively preparing and diluting chemicals
    5.
    发明授权
    High dilution ratio by successively preparing and diluting chemicals 有权
    连续制备和稀释化学品的高稀释比

    公开(公告)号:US09223319B2

    公开(公告)日:2015-12-29

    申请号:US13724786

    申请日:2012-12-21

    IPC分类号: G05D11/13

    CPC分类号: G05D11/138

    摘要: A system and method for providing a plurality of diluted solutions are disclosed. Successive dilution operations are performed upon mixing vessels substantially simultaneously. Measured source volumes of a source solution are placed into the mixing vessels. First measured volumes of a liquid are added to the mixing vessels. Measured first waste volumes are dispensed from the mixing vessels. Second measured volumes of the liquid are added to the mixing vessels. Measured second waste volumes are dispensed from the mixing vessels. Third measured volumes of the liquid are added to the mixing vessels. Each vessel has an individual target dilution ratio. Measured volumes and number of dilution operations are individual to each of the mixing vessels.

    摘要翻译: 公开了一种用于提供多种稀释溶液的系统和方法。 基本上同时进行混合容器的连续稀释操作。 将源溶液的测量源体积放入混合容器中。 将第一体积的液体加入到混合容器中。 测量的第一废物体积从混合容器中分配。 将液体的第二测量体积加到混合容器中。 从混合容器中分配测量的第二废物体积。 将液体的第三测量体积加到混合容器中。 每个容器具有单独的目标稀释比。 测量体积和稀释操作次数对于每个混合容器是独立的。

    Processing and Cleaning Substrates
    6.
    发明申请
    Processing and Cleaning Substrates 审中-公开
    加工和清洁基材

    公开(公告)号:US20140174481A1

    公开(公告)日:2014-06-26

    申请号:US14189014

    申请日:2014-02-25

    IPC分类号: H01L21/02

    摘要: The embodiments describe methods for controlling the particles generated when cleaning and drying a wafer in a spin rinse dryer (SRD) module. In some embodiments, the substrate surface is cooled by dispensing deionized (DI) water across the surface of the substrate, while the substrate rests on the SRD chuck. In addition, a method for controlling the particles generated when sleeves in a processing module or SRD contact a substrate surface during a clamping operation or when the sleeves are removed from the substrate surface is provided. A bottom edge or lip of the sleeves and/or the surface of the wafer contacting the sleeve is wetted during clamping/unclamping operations. Alternatively, the substrate may be wetted prior to clamping/unclamping operations.

    摘要翻译: 实施例描述了用于控制在旋转冲洗干燥器(SRD)模块中清洁和干燥晶片时产生的颗粒的方法。 在一些实施例中,通过在衬底的表面上分配去离子(DI)水来冷却衬底表面,同时衬底搁置在SRD卡盘上。 此外,提供了一种用于控制在夹持操作期间或当衬套从衬底表面移除时在处理模块或SRD中的套筒接触衬底表面时产生的颗粒的方法。 在夹紧/松开操作期间,套筒的底部边缘或/或与晶片接触的晶片表面被润湿。 或者,在夹紧/松开操作之前可以润湿基底。

    Method and apparatus for improving particle performance
    7.
    发明授权
    Method and apparatus for improving particle performance 有权
    提高颗粒性能的方法和装置

    公开(公告)号:US09076674B2

    公开(公告)日:2015-07-07

    申请号:US13626649

    申请日:2012-09-25

    发明人: Satbir Kahlon

    IPC分类号: H01L21/66 H01L21/67

    CPC分类号: H01L22/10 H01L21/6719

    摘要: A method for combinatorially processing a substrate is provided. The method includes providing a substrate disposed on a substrate support. The method further includes rigidly locking a top portion of a sleeve to a bottom portion of a process head of a combinatorial processing device, where the combinatorial processing device is operable to concurrently process different regions of the substrate differently. The method includes raising the substrate and the substrate support to contact a sealing surface of the sleeve with a surface of the substrate and combinatorially processing the different regions of the substrate.

    摘要翻译: 提供了一种用于组合处理衬底的方法。 该方法包括提供设置在基板支撑件上的基板。 该方法还包括将套筒的顶部刚性地锁定到组合处理装置的过程头部的底部,其中组合处理装置可操作以不同地同时处理衬底的不同区域。 该方法包括升高衬底和衬底支撑件以使衬套的密封表面与衬底的表面接触并且组合地处理衬底的不同区域。

    Methods and systems for dispensing different liquids for high productivity combinatorial processing
    8.
    发明授权
    Methods and systems for dispensing different liquids for high productivity combinatorial processing 有权
    用于分配不同液体以用于高生产率组合处理的方法和系统

    公开(公告)号:US08893923B2

    公开(公告)日:2014-11-25

    申请号:US13687906

    申请日:2012-11-28

    IPC分类号: B67B7/00 H01L21/00

    摘要: Provided are methods and systems for dispensing different chemicals used for high productivity combinatorial processing. A dispense panel may include multiple inlet lines for supplying different chemicals. Each inlet line is connected to its own three-way valve that either allows the supplied chemical to flow from the inlet line towards a dispense valve connected to a dispense manifold (during dispensing of the supplied chemical) or allows another chemical to flow from the dispense valve to a waste manifold (during priming of the dispense manifold with this other chemical). Specifically, during priming a chemical supplied from its inlet line and is passed through a corresponding three-way valve and is directed to its dispense valve and then into the dispense manifold. Other dispense valves and three-way valves of the dispense panel allow this chemical to flow out of the dispense manifold, thereby priming remaining parts of the panel.

    摘要翻译: 提供了用于分配用于高生产率组合处理的不同化学品的方法和系统。 分配面板可以包括用于供应不同化学品的多个入口管线。 每个入口管路连接到其自己的三通阀,其允许供应的化学品从入口管线流向连接到分配歧管的分配阀(在分配供应的化学品期间)或允许另一种化学品从分配流出 阀门到废液歧管(在使用这种其他化学品的分配歧管启动期间)。 具体来说,在从其入口管线引入化学物质并通过相应的三通阀时,被引导到其分配阀然后进入分配歧管。 分配面板的其他分配阀和三通阀允许该化学品流出分配歧管,从而引发面板的剩余部分。

    High Dilution Ratio by Successively Preparing and Diluting Chemicals
    9.
    发明申请
    High Dilution Ratio by Successively Preparing and Diluting Chemicals 有权
    连续制备和稀释化学品的高稀释比

    公开(公告)号:US20140177378A1

    公开(公告)日:2014-06-26

    申请号:US13724786

    申请日:2012-12-21

    IPC分类号: B01F15/04

    CPC分类号: G05D11/138

    摘要: A system and method for providing a plurality of diluted solutions are disclosed. Successive dilution operations are performed upon mixing vessels substantially simultaneously. Measured source volumes of a source solution are placed into the mixing vessels. First measured volumes of a liquid are added to the mixing vessels. Measured first waste volumes are dispensed from the mixing vessels. Second measured volumes of the liquid are added to the mixing vessels. Measured second waste volumes are dispensed from the mixing vessels. Third measured volumes of the liquid are added to the mixing vessels. Each vessel has an individual target dilution ratio. Measured volumes and number of dilution operations are individual to each of the mixing vessels.

    摘要翻译: 公开了一种用于提供多种稀释溶液的系统和方法。 基本上同时进行混合容器的连续稀释操作。 将源溶液的测量源体积放入混合容器中。 将第一体积的液体加入到混合容器中。 测量的第一废物体积从混合容器中分配。 将液体的第二测量体积加到混合容器中。 从混合容器中分配测量的第二废物体积。 将液体的第三测量体积加到混合容器中。 每个容器具有单独的目标稀释比。 测量体积和稀释操作次数对于每个混合容器是独立的。

    Method to Improve the Operational Robustness and Safety of Combinatorial Processing Systems
    10.
    发明申请
    Method to Improve the Operational Robustness and Safety of Combinatorial Processing Systems 审中-公开
    提高组合加工系统运行稳健性和安全性的方法

    公开(公告)号:US20140174656A1

    公开(公告)日:2014-06-26

    申请号:US13722170

    申请日:2012-12-20

    IPC分类号: B05C11/00

    CPC分类号: H01L21/67017 H01L21/67086

    摘要: Methods and apparatuses for combinatorial processing are disclosed. Apparatuses include a wet etch module (WEM) operable to combinatorially etch a substrate having at least two site-isolated regions. The WEM includes a dispense manifold operable to dispense fluids and a mixing vessel unit operable to mix fluids. The WEM further includes a reactor unit operable to receive fluids from the dispense manifold or the mixing vessel unit. The reactor unit can apply a combinatorial process on a substrate having at least two site-isolated regions within the WEM. In addition, a secondary containment unit, having a leak sensor therein, is coupled to the dispense manifold, mixing vessel unit, or reactor unit to receive fluid leaks within the system. When the leak sensor detects a fluid leak, a warning may be generated. Advantageously, the generated warning does not impede substrate processing within the WEM.

    摘要翻译: 公开了用于组合处理的方法和装置。 设备包括湿蚀刻模块(WEM),其可操作以组合蚀刻具有至少两个位置隔离区域的衬底。 WEM包括可分配流体的分配歧管和可操作以混合流体的混合容器单元。 WEM还包括可操作以从分配歧管或混合容器单元接收流体的反应器单元。 反应器单元可以在WEM中具有至少两个位置隔离区域的基底上施加组合方法。 此外,在其中具有泄漏传感器的辅助容纳单元联接到分配歧管,混合容器单元或反应器单元以接收系统内的流体泄漏。 当泄漏传感器检测到液体泄漏时,可能会产生警告。 有利地,产生的警告不妨碍WEM内的衬底处理。