Invention Application
- Patent Title: NOZZLE AND SUBSTRATE PROCESSING APPARATUS USING SAME
- Patent Title (中): 喷嘴和底板加工设备使用相同
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Application No.: US14933123Application Date: 2015-11-05
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Publication No.: US20160138158A1Publication Date: 2016-05-19
- Inventor: Yu WAMURA , Fumiaki HAYASE , Masahiko KAMINISHI , Kosuke TAKAHASHI , Hiroko SASAKI , Yu SASAKI
- Applicant: Tokyo Electron Limited
- Priority: JP2014-234500 20141119
- Main IPC: C23C16/455
- IPC: C23C16/455 ; B05B1/20

Abstract:
A nozzle for supplying a fluid includes a tubular part including a tubular passage thereinside and a fluid discharge surface having a plurality of fluid discharge holes formed therein along a lengthwise direction of the tubular passage. A partition plate is provided in the tubular passage and extends along the lengthwise direction so as to partition the tubular passage into a first area including the fluid discharge surface and a second area without the fluid discharge surface. The partition plate has distribution holes whose number is less than a number of the plurality of fluid discharge holes in the lengthwise direction. A fluid introduction passage is in communication with the second area.
Public/Granted literature
- US10472719B2 Nozzle and substrate processing apparatus using same Public/Granted day:2019-11-12
Information query
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