发明申请
US20160148822A1 SUBSTRATE CARRIER USING A PROPORTIONAL THERMAL FLUID DELIVERY SYSTEM
审中-公开
使用比例热流体输送系统的基座载体
- 专利标题: SUBSTRATE CARRIER USING A PROPORTIONAL THERMAL FLUID DELIVERY SYSTEM
- 专利标题(中): 使用比例热流体输送系统的基座载体
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申请号: US14555467申请日: 2014-11-26
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公开(公告)号: US20160148822A1公开(公告)日: 2016-05-26
- 发明人: Phillip Criminale , Justin Phi , Dan A. Marohl , Sergio Fukuda Shoji , Brad L. Mays
- 申请人: Phillip Criminale , Justin Phi , Dan A. Marohl , Sergio Fukuda Shoji , Brad L. Mays
- 主分类号: H01L21/67
- IPC分类号: H01L21/67 ; H01L21/66 ; H01L21/683 ; H01J37/32 ; H01L21/3065
摘要:
A substrate carrier is described that uses a proportional thermal fluid delivery system In one example the apparatus includes a heat exchanger to provide a thermal fluid to a fluid channel of a substrate carrier and to receive the thermal fluid from the fluid channel, the thermal fluid in the fluid channel to control the temperature of the carrier during substrate processing. A proportional valve controls the rate of flow of thermal fluid from the heat exchanger to the fluid channel, A temperature controller receives a measured temperature from a thermal sensor of the carrier and controls the proportional valve in response to the measured temperature to adjust the rate of flow.
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