公开(公告)号：US20160148822A1

公开(公告)日：2016-05-26

申请号：US14555467

申请日：2014-11-26

申请人： Phillip Criminale ,  Justin Phi ,  Dan A. Marohl ,  Sergio Fukuda Shoji ,  Brad L. Mays

发明人： Phillip Criminale ,  Justin Phi ,  Dan A. Marohl ,  Sergio Fukuda Shoji ,  Brad L. Mays

IPC分类号： H01L21/67 ,  H01L21/66 ,  H01L21/683 ,  H01J37/32 ,  H01L21/3065

CPC分类号： H01L21/67248 ,  H01J37/32724 ,  H01L21/67017 ,  H01L21/67109 ,  H01L21/6831

摘要： A substrate carrier is described that uses a proportional thermal fluid delivery system In one example the apparatus includes a heat exchanger to provide a thermal fluid to a fluid channel of a substrate carrier and to receive the thermal fluid from the fluid channel, the thermal fluid in the fluid channel to control the temperature of the carrier during substrate processing. A proportional valve controls the rate of flow of thermal fluid from the heat exchanger to the fluid channel, A temperature controller receives a measured temperature from a thermal sensor of the carrier and controls the proportional valve in response to the measured temperature to adjust the rate of flow.

摘要翻译： 描述了使用比例热流体输送系统的衬底载体。在一个示例中，该装置包括热交换器，以将热流体提供给衬底载体的流体通道并从流体通道接收热流体， 流体通道，用于在衬底处理期间控制载体的温度。 比例阀控制从热交换器到流体通道的热流体的流速。温度控制器从载体的热传感器接收测量的温度，并根据测量的温度控制比例阀，以调节速度 流。