Invention Application
- Patent Title: SOCKET LOADING ELEMENT AND ASSOCIATED TECHNIQUES AND CONFIGURATIONS
- Patent Title (中): 插座加载元件及相关技术和配置
-
Application No.: US14578037Application Date: 2014-12-19
-
Publication No.: US20160183375A1Publication Date: 2016-06-23
- Inventor: Vijaykumar Krithivasan , Jeffory L. Smalley , David J. Llapitan , Gaurav Chawla , Mani Prakash , Susan F. Smith
- Applicant: Intel Corporation
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H01L23/40 ; H01L23/498 ; B23P15/26 ; H01L21/48 ; H05K3/32 ; H05K7/20 ; H01L23/367 ; H01L21/50

Abstract:
Embodiments of the present disclosure are directed towards a socket loading element and associated techniques and configurations. In one embodiment, an apparatus may include a loading element configured to transfer a compressive load from a heat spreader to a socket assembly, wherein the loading element is configured to form a perimeter around a die when the loading element is coupled with an interposer disposed between the die and the socket assembly and wherein the loading element includes an opening configured to accommodate the die. Other embodiments may be described and/or claimed.
Public/Granted literature
- US09848510B2 Socket loading element and associated techniques and configurations Public/Granted day:2017-12-19
Information query