Invention Application
- Patent Title: SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Patent Title (中): 半导体结构及其制造方法
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Application No.: US15203045Application Date: 2016-07-06
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Publication No.: US20160315065A1Publication Date: 2016-10-27
- Inventor: CHEN-CHUN CHEN , CHIU-JUNG CHEN , FU-TSUN TSAI , SHIU-KO JANGJIAN , CHI-CHERNG JENG , HSIN-CHI CHEN
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L27/146 ; H01L21/027 ; H01L21/306 ; H01L21/268
Abstract:
A method of manufacturing a semiconductor structure includes providing a first wafer including a surface, removing some portions of the first wafer over the surface to form a plurality of recesses extended over at least a portion of the surface of the first wafer, providing a second wafer, and disposing the second wafer over the surface of the first wafer.
Public/Granted literature
- US09666555B2 Manufacturing method of forming a semiconductor wafer structure Public/Granted day:2017-05-30
Information query
IPC分类:
