Invention Application
- Patent Title: OPTOELECTRONIC SEMICONDUCTOR CHIP, OPTOELECTRONIC SEMICONDUCTOR COMPONENT, AND A METHOD FOR PRODUCING AN OPTOELECTRONIC SEMICONDUCTOR COMPONENT
- Patent Title (中): 光电子半导体芯片,光电半导体元件和生产光电半导体元件的方法
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Application No.: US15227287Application Date: 2016-08-03
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Publication No.: US20160343917A1Publication Date: 2016-11-24
- Inventor: Dominik Eisert , Torsten Baade , Michael Zitzlsperger
- Applicant: OSRAM Opto Semiconductors GmbH
- Priority: DE102011050450.8 20110518
- Main IPC: H01L33/50
- IPC: H01L33/50 ; H01L33/62 ; H01L33/06 ; H01L33/32 ; H01L33/28 ; H01L33/56 ; H01L33/60

Abstract:
An optoelectronic semiconductor chip includes a semiconductor body that emits primary light, and a luminescence conversion element that emits secondary light by wavelength conversion of at least part of the primary light, wherein the luminescence conversion element has a first lamina fixed to a first partial region of an outer surface of the semiconductor body, the outer surface emitting primary light, and leaving free a second partial region of the outer surface, the luminescence conversion element has a second lamina fixed to a surface of the first lamina facing away from the semiconductor body and spaced apart from the semiconductor body, the first lamina is at least partly transmissive to the primary radiation, a section of the second lamina covers at least the second partial region, and at least the section of the second lamina is absorbent and/or reflective and/or scattering for the primary radiation.
Public/Granted literature
Information query
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