Invention Application
- Patent Title: TEST STRUCTURES FOR DIELECTRIC RELIABILITY EVALUATIONS
- Patent Title (中): 用于电介质可靠性评估的测试结构
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Application No.: US14742895Application Date: 2015-06-18
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Publication No.: US20160372389A1Publication Date: 2016-12-22
- Inventor: David G. Brochu, JR. , Roger A. Dufresne , Baozhen Li , Barry P. Linder , James H. Stathis , Ernest Y. Wu
- Applicant: GLOBALFOUNDRIES INC.
- Main IPC: H01L21/66
- IPC: H01L21/66 ; H01L21/768 ; H01L29/66 ; G01R31/28 ; H01L21/28

Abstract:
Methods and test structures for testing the reliability of a dielectric material. The test structure may include a first row of contacts and a line comprised of a conductor. The line is laterally spaced in a direction at a minimum distance from the first row of contacts. The test structure further includes a second row of contacts laterally spaced in the direction from the first row of contacts by a distance equal to two times a minimum pitch. The line is laterally positioned between the first row of contacts and the second row of contacts.
Public/Granted literature
- US10103060B2 Test structures for dielectric reliability evaluations Public/Granted day:2018-10-16
Information query
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