Invention Application
- Patent Title: METHOD OF FORMING A TRANSISTOR AND STRUCTURE THEREFOR
- Patent Title (中): 形成晶体管及其结构的方法
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Application No.: US15261308Application Date: 2016-09-09
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Publication No.: US20160380079A1Publication Date: 2016-12-29
- Inventor: Balaji PADMANABHAN , Prasad VENKATRAMAN , Gordon M. GRIVNA
- Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Applicant Address: US AZ Phoenix
- Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee Address: US AZ Phoenix
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/423 ; H01L29/417 ; H01L29/78 ; H01L29/40
Abstract:
In one embodiment, a semiconductor device is formed to include a gate structure extending into a semiconductor material that is underlying a first region of semiconductor material. The gate structure includes a conductor and also a gate insulator that has a first portion positioned between the gate conductor and a first portion of the semiconductor material that underlies the gate conductor. The first portion of the semiconductor material is configured to form a channel region of the transistor which underlies the gate conductor. The gate structure may also include a shield conductor overlying the gate conductor and having a shield insulator between the shield conductor and the gate conductor. The shield insulator may also have a second portion positioned between the shield conductor and a second portion of the gate insulator and a third portion overlying the shield conductor.
Public/Granted literature
- US09780196B2 Method of forming a semiconductor device including forming a shield conductor overlying a gate conductor Public/Granted day:2017-10-03
Information query
IPC分类:
