Invention Application
US20170001221A1 METHOD AND APPARATUS FOR TREATING SUBSTRATE 审中-公开
用于处理基板的方法和装置

  • Patent Title: METHOD AND APPARATUS FOR TREATING SUBSTRATE
  • Patent Title (中): 用于处理基板的方法和装置
  • Application No.: US15195262
    Application Date: 2016-06-28
  • Publication No.: US20170001221A1
    Publication Date: 2017-01-05
  • Inventor: Taekyoub Lee
  • Applicant: Semes Co., Ltd.
  • Priority: KR10-2015-0093162 20150630
  • Main IPC: B08B3/02
  • IPC: B08B3/02 H01L21/02 H01L21/67 B08B3/08
METHOD AND APPARATUS FOR TREATING SUBSTRATE
Abstract:
A method for treating a substrate with a treatment liquid is disclosed, wherein the substrate is treated while a location at which the treatment liquid is supplied onto the substrate that is rotated is moved in an outward direction from a central area of the substrate towards a peripheral area of the substrate and in an inward direction from a peripheral area of the substrate towards a central area of the substrate a plurality of times, and wherein the movement distances of some of the plurality of movements are different from each other.
Public/Granted literature
Information query
Patent Agency Ranking
0/0