Invention Application
- Patent Title: METHOD AND APPARATUS FOR TREATING SUBSTRATE
- Patent Title (中): 用于处理基板的方法和装置
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Application No.: US15195262Application Date: 2016-06-28
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Publication No.: US20170001221A1Publication Date: 2017-01-05
- Inventor: Taekyoub Lee
- Applicant: Semes Co., Ltd.
- Priority: KR10-2015-0093162 20150630
- Main IPC: B08B3/02
- IPC: B08B3/02 ; H01L21/02 ; H01L21/67 ; B08B3/08

Abstract:
A method for treating a substrate with a treatment liquid is disclosed, wherein the substrate is treated while a location at which the treatment liquid is supplied onto the substrate that is rotated is moved in an outward direction from a central area of the substrate towards a peripheral area of the substrate and in an inward direction from a peripheral area of the substrate towards a central area of the substrate a plurality of times, and wherein the movement distances of some of the plurality of movements are different from each other.
Public/Granted literature
- US10335836B2 Method and apparatus for treating substrate Public/Granted day:2019-07-02
Information query
IPC分类: