METHOD AND APPARATUS FOR TREATING SUBSTRATE
    1.
    发明申请
    METHOD AND APPARATUS FOR TREATING SUBSTRATE 审中-公开
    用于处理基板的方法和装置

    公开(公告)号:US20170001221A1

    公开(公告)日:2017-01-05

    申请号:US15195262

    申请日:2016-06-28

    Inventor: Taekyoub Lee

    Abstract: A method for treating a substrate with a treatment liquid is disclosed, wherein the substrate is treated while a location at which the treatment liquid is supplied onto the substrate that is rotated is moved in an outward direction from a central area of the substrate towards a peripheral area of the substrate and in an inward direction from a peripheral area of the substrate towards a central area of the substrate a plurality of times, and wherein the movement distances of some of the plurality of movements are different from each other.

    Abstract translation: 公开了一种用处理液处理基板的方法,其中处理液体的处理液体被供给到旋转的基板上的位置从基板的中心区域向外侧向周向移动 并且从衬底的周边区域到衬底的中心区域的向内方向多次,并且其中多个运动中的一些运动的移动距离彼此不同。

    Method and apparatus for treating substrate

    公开(公告)号:US10335836B2

    公开(公告)日:2019-07-02

    申请号:US15195262

    申请日:2016-06-28

    Inventor: Taekyoub Lee

    Abstract: A method for treating a substrate with a treatment liquid is disclosed, wherein the substrate is treated while a location at which the treatment liquid is supplied onto the substrate that is rotated is moved in an outward direction from a central area of the substrate towards a peripheral area of the substrate and in an inward direction from a peripheral area of the substrate towards a central area of the substrate a plurality of times, and wherein the movement distances of some of the plurality of movements are different from each other.

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