Invention Application
US20170044402A1 CHEMICAL-MECHANICAL POLISHING COMPOSITIONS COMPRISING N,N,N′,N′-TETRAKIS-(2-HYDROXYPROPYL)-ETHYLENEDIAMINE OR METHANESULFONIC ACID
审中-公开
包含N，N，N'，N'-四（2-羟基丙基） - 乙烯二胺或甲磺酸的化学机械抛光组合物
- Patent Title: CHEMICAL-MECHANICAL POLISHING COMPOSITIONS COMPRISING N,N,N′,N′-TETRAKIS-(2-HYDROXYPROPYL)-ETHYLENEDIAMINE OR METHANESULFONIC ACID
- Patent Title (中): 包含N，N，N'，N'-四（2-羟基丙基） - 乙烯二胺或甲磺酸的化学机械抛光组合物
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Application No.: US15336245Application Date: 2016-10-27
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Publication No.: US20170044402A1Publication Date: 2017-02-16
- Inventor: Yongqing Lan , Peter Przybylski , Zhenyu Bao , Julian Proelss
- Applicant: BASF SE
- Applicant Address: DE Ludwigshafen
- Assignee: BASF SE
- Current Assignee: BASF SE
- Current Assignee Address: DE Ludwigshafen
- Priority: EP13167899.7 20130515
- Main IPC: C09G1/02
- IPC: C09G1/02 ; H01L21/306 ; C09K3/14
Abstract:
Described is a chemical-mechanical polishing (CMP) composition comprising the following components:(A) surface modified silica particles having a negative zeta potential of −15 mV or below at a pH in the range of from 2 to 6(B) N,N,N′,N′-tetrakis-(2-hydroxypropyl)-ethylenediamine or methanesulfonic acid(C) water(D) optionally one or more further constituents,wherein the pH of the composition is in the range of from 2 to 6.
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