Invention Application
US20170069471A1 RING MEMBER WITH AIR HOLES AND SUBSTRATE PROCESSING SYSTEM INCLUDING THE SAME
审中-公开
具有气孔的环形构件和包括其的衬底处理系统
- Patent Title: RING MEMBER WITH AIR HOLES AND SUBSTRATE PROCESSING SYSTEM INCLUDING THE SAME
- Patent Title (中): 具有气孔的环形构件和包括其的衬底处理系统
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Application No.: US15255626Application Date: 2016-09-02
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Publication No.: US20170069471A1Publication Date: 2017-03-09
- Inventor: Chulkyun SEOK , Taekyun KANG , JungHwan UM , Changwon CHOI
- Applicant: Samsung Electronics Co., Ltd.
- Priority: KR10-2015-0125718 20150904
- Main IPC: H01J37/32
- IPC: H01J37/32 ; H01L21/683 ; H01L21/67
Abstract:
A substrate processing system includes a wall liner, an electrostatic chuck in the wall liner to hold a substrate, and a ring member including a focus ring and a side ring. The focus ring is on an edge region of the electrostatic chuck and the side ring encloses an outer side surface of the focus ring and a side surface of the electrostatic chuck. The side ring includes air holes extending from a bottom surface of the ring member towards a top portion of the ring member and extending from the top portion of the ring member towards an outer side surface of the ring member.
Public/Granted literature
- US10312059B2 Ring member with air holes and substrate processing system including the same Public/Granted day:2019-06-04
Information query
