公开(公告)号：US20190287766A1

公开(公告)日：2019-09-19

申请号：US16182737

申请日：2018-11-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： SANGJEAN JEON ,  Jinyoung PARK ,  CHANHOON PARK ,  Hoyong PARK ,  JIN YOUNG BANG ,  JungHwan UM ,  IL SUP CHOI ,  Je-Woo HAN

IPC: H01J37/32 ,  H01L21/683

Abstract: A system for fabricating a semiconductor device may include a chamber, an electrostatic chuck used to load a substrate, a power source supplying an RF power to the electrostatic chuck, an impedance matcher between the power source and the electrostatic chuck, and a power transmission unit connecting the electrostatic chuck to the impedance matcher. The power transmission unit may include a power rod, which is connected to the electrostatic chuck and has a first outer diameter, and a coaxial cable. The coaxial cable may include an inner wire, an outer wire, and a dielectric material between the outer and inner wires. The inner wire connects the power rod to the impedance matcher and has a second outer diameter less than the first outer diameter. The outer wire is connected to the chamber and is provided to enclose the inner wire and has a first inner diameter less than the first outer diameter and greater than the second outer diameter. A ratio of the first inner diameter to the second outer diameter is greater than a dielectric constant of the dielectric material and less than three times the dielectric constant of the dielectric material.

公开(公告)号：US20170069471A1

公开(公告)日：2017-03-09

申请号：US15255626

申请日：2016-09-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chulkyun SEOK ,  Taekyun KANG ,  JungHwan UM ,  Changwon CHOI

IPC: H01J37/32 ,  H01L21/683 ,  H01L21/67

CPC classification number: H01J37/32642 ,  H01J37/32082 ,  H01J37/3244 ,  H01J37/32477 ,  H01J37/32697 ,  H01J37/32715

Abstract: A substrate processing system includes a wall liner, an electrostatic chuck in the wall liner to hold a substrate, and a ring member including a focus ring and a side ring. The focus ring is on an edge region of the electrostatic chuck and the side ring encloses an outer side surface of the focus ring and a side surface of the electrostatic chuck. The side ring includes air holes extending from a bottom surface of the ring member towards a top portion of the ring member and extending from the top portion of the ring member towards an outer side surface of the ring member.

Abstract translation: 衬底处理系统包括壁衬，壁衬中的用于保持衬底的静电吸盘，以及包括聚焦环和侧环的环构件。 聚焦环位于静电卡盘的边缘区域上，侧环包围聚焦环的外侧表面和静电卡盘的侧表面。 侧环包括从环形构件的底表面朝向环形构件的顶部延伸并从环形构件的顶部朝向环形构件的外侧表面延伸的气孔。