Invention Application
US20170075222A1 PATTERN FORMING METHOD, RESIST PATTERN, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC DEVICE
审中-公开
图案形成方法,电阻图案,制造电子器件的方法和电子器件
- Patent Title: PATTERN FORMING METHOD, RESIST PATTERN, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC DEVICE
- Patent Title (中): 图案形成方法,电阻图案,制造电子器件的方法和电子器件
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Application No.: US15358537Application Date: 2016-11-22
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Publication No.: US20170075222A1Publication Date: 2017-03-16
- Inventor: Toru TSUCHIHASHI , Wataru NIHASHI , Hideaki TSUBAKI
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Priority: JP2014-155946 20140731
- Main IPC: G03F7/039
- IPC: G03F7/039 ; G03F7/20 ; C08F220/18 ; G03F7/32 ; G03F7/40 ; G03F7/004 ; G03F7/16

Abstract:
A pattern forming method includes, in this order, forming a film on a substrate, using an active-light-sensitive or radiation-sensitive resin composition containing a resin (A) which has a repeating unit having a phenolic hydroxyl group, and a repeating unit having a group that decomposes by the action of an acid to generate a carboxyl group, and a compound (B) that generates an acid upon irradiation with active light or radiation; exposing the film; and developing the exposed film using a developer including an organic solvent, in which the developer including an organic solvent contains an organic solvent having 8 or more carbon atoms and 2 or less heteroatoms in the amount of 50% by mass or more.
Public/Granted literature
- US10890847B2 Pattern forming method, resist pattern, method for manufacturing electronic device, and electronic device Public/Granted day:2021-01-12
Information query
IPC分类: