Invention Application
- Patent Title: METHOD FOR FABRICATING PACKAGE STRUCTURE
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Application No.: US15298480Application Date: 2016-10-20
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Publication No.: US20170103953A1Publication Date: 2017-04-13
- Inventor: Chih-Hsien Chiu , Hsin-Lung Chung , Cho-Hsin Chang , Chia-Yang Chen , Chao-Ya Yang
- Applicant: Siliconware Precision Industries Co., Ltd.
- Priority: TW103125448 20140725
- Main IPC: H01L23/552
- IPC: H01L23/552 ; H01L21/48 ; H01L25/065 ; H01L23/66 ; H01L23/31 ; H01L23/00 ; H01L21/56 ; H01L21/78
Abstract:
A package structure includes a carrier, an electronic component disposed on the carrier, an encapsulant formed on the carrier for encapsulating the electronic component, a first shielding layer formed on the encapsulant, and a second shielding layer formed on the first shielding layer. The first and second shielding layers are made of different materials. With the multiple shielding layers formed on the encapsulating layer, the electronic component is protected from electromagnetic interferences. The present invention also provides a method for fabricating the package structure.
Public/Granted literature
- US09899335B2 Method for fabricating package structure Public/Granted day:2018-02-20
Information query
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