公开(公告)号：US10587037B2

公开(公告)日：2020-03-10

申请号：US14107446

申请日：2013-12-16

Applicant: Siliconware Precision Industries Co., Ltd

Inventor： Chih-Hsien Chiu ,  Heng-Cheng Chu ,  Chien-Cheng Lin ,  Tsung-Hsien Tsai ,  Chao-Ya Yang ,  Yude Chu

IPC: H01Q1/38 ,  H01Q1/22 ,  H01Q9/04 ,  H01Q1/24

Abstract: An electronic package structure is provided, including a substrate, a package encapsulant disposed on the substrate, and an antenna structure corresponding to a disposing area of the package encapsulant and having a first extension layer, a second extension layer disposed on the substrate, and a connection portion disposed between and electrically connected to the first extension layer and the second extension layer. Through the formation of the antenna structure on the disposing area of the package encapsulant, the substrate is not required to be widen, and, as such, the electronic package structure meets the miniaturization requirement.

公开(公告)号：US20220225493A1

公开(公告)日：2022-07-14

申请号：US17465335

申请日：2021-09-02

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Ming-Fan Tsai ,  Chih-Wei Chen ,  Chien-Cheng Lin ,  Chao-Ya Yang ,  Chia-Yang Chen

IPC: H05K1/02

Abstract: An electronic device is provided, in which an antenna module for receiving and transmitting radiation signals is disposed on a mounting surface of a circuit board, and an inner layer of the circuit board is formed with a ground surface to arrange a strip-shaped ground circuit along the edges of the ground surface so that the ground circuit occupies at most 50% of the area of the ground surface to improve antenna radiation efficiency.

公开(公告)号：US10230152B2

公开(公告)日：2019-03-12

申请号：US14098490

申请日：2013-12-05

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu ,  Heng-Cheng Chu ,  Chien-Cheng Lin ,  Tsung-Hsien Tsai ,  Chao-Ya Yang

IPC: H01Q1/24 ,  H01Q1/22 ,  H01Q1/52 ,  H01L23/552

Abstract: An electronic package is provided, which includes: a substrate; at least an electronic element disposed on the substrate; an antenna structure disposed on the substrate; and an encapsulant formed on the substrate for encapsulating the electronic element and the antenna structure. Therein, the antenna structure has an extension portion and a plurality of support portions connected to the extension portion for supporting the extension portion over the substrate so as to save the surface area of the substrate, thereby meeting the miniaturization requirement of the electronic package.

公开(公告)号：US20160081234A1

公开(公告)日：2016-03-17

申请号：US14607743

申请日：2015-01-28

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu ,  Hsin-Lung Chung ,  Chia-Yang Chen ,  Chao-Ya Yang ,  Yude Chu ,  Chih-Ming Cheng

IPC: H05K9/00

CPC classification number: H01L23/552 ,  H01L25/0657 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A package structure is provided, including an electronic element with a low frequency, a shielding member connected to the electrosnic element, and an encapsulant covering the electronic element and the shielding member, such that the electronic element is shielded from erroneous signals.

Abstract translation: 提供一种封装结构，包括低频电子元件，连接到电气元件的屏蔽构件，以及覆盖电子元件和屏蔽构件的密封剂，使得电子元件被屏蔽而不会发生错误信号。

公开(公告)号：US20130320513A1

公开(公告)日：2013-12-05

申请号：US13660277

申请日：2012-10-25

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Chien-Cheng Lin ,  Tsung-Hsien Hsu ,  Heng-Cheng Chu ,  Chao-Ya Yang ,  Chih-Ming Cheng

IPC: H01L23/552 ,  H01L21/56

CPC classification number: H01L24/27 ,  H01L21/563 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/552 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/16225 ,  H01L2224/2929 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83951 ,  H01L2224/92125 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06558 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2924/00015 ,  H01L2924/0781 ,  H01L2924/00

Abstract: A semiconductor package is provided, including: a substrate having at least a conductive pad; a semiconductor element disposed on the substrate; a conductive adhesive formed on top and side surfaces of the semiconductor element and extending to the conductive pad; and an electronic element disposed on the conductive adhesive. The conductive adhesive and the conductive pad form a shielding structure so as to prevent electromagnetic interference from occurring between the semiconductor element and the electronic element.

Abstract translation: 提供一种半导体封装，包括：具有至少导电焊盘的衬底; 设置在所述基板上的半导体元件; 形成在半导体元件的顶表面和侧表面上并延伸到导电焊盘的导电粘合剂; 以及设置在导电粘合剂上的电子元件。 导电粘合剂和导电垫形成屏蔽结构，以防止在半导体元件和电子元件之间发生电磁干扰。

公开(公告)号：US11723144B2

公开(公告)日：2023-08-08

申请号：US17465335

申请日：2021-09-02

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Ming-Fan Tsai ,  Chih-Wei Chen ,  Chien-Cheng Lin ,  Chao-Ya Yang ,  Chia-Yang Chen

IPC: H05K1/02

CPC classification number: H05K1/0225 ,  H05K2201/10098

Abstract: An electronic device is provided, in which an antenna module for receiving and transmitting radiation signals is disposed on a mounting surface of a circuit board, and an inner layer of the circuit board is formed with a ground surface to arrange a strip-shaped ground circuit along the edges of the ground surface so that the ground circuit occupies at most 50% of the area of the ground surface to improve antenna radiation efficiency.

公开(公告)号：US11069633B2

公开(公告)日：2021-07-20

申请号：US16028798

申请日：2018-07-06

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Ming-Fan Tsai ,  Chih-Hsien Chiu ,  Tsung-Hsien Tsai ,  Chao-Ya Yang ,  Chia-Yang Chen

IPC: H01L23/66 ,  H01L23/498 ,  H01L23/552 ,  H01L23/04 ,  H01Q1/22 ,  H01Q1/52 ,  H01Q1/24 ,  H01Q9/42 ,  H01L23/31 ,  H01L23/00

Abstract: The disclosure provides an electronic package, including a carrier, an electronic component disposed on the carrier, a buffer, and an antenna structure, wherein the antenna structure includes a metal frame disposed on the carrier and a wire disposed on the carrier and electrically connected to the metal frame, and the buffer covers the wire so as to reduce the emission wave speed of the wire and thus the wavelength is shorten, thereby satisfying the length requirement of the antenna within the limited space of the carrier and achieving an operating frequency radiated as required.

公开(公告)号：US08963299B2

公开(公告)日：2015-02-24

申请号：US13660277

申请日：2012-10-25

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chien-Cheng Lin ,  Tsung-Hsien Hsu ,  Heng-Cheng Chu ,  Chao-Ya Yang ,  Chih-Ming Cheng

IPC: H01L23/552 ,  H01L21/00

CPC classification number: H01L24/27 ,  H01L21/563 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/552 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/16225 ,  H01L2224/2929 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83951 ,  H01L2224/92125 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06558 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2924/00015 ,  H01L2924/0781 ,  H01L2924/00

Abstract: A semiconductor package is provided, including: a substrate having at least a conductive pad; a semiconductor element disposed on the substrate; a conductive adhesive formed on top and side surfaces of the semiconductor element and extending to the conductive pad; and an electronic element disposed on the conductive adhesive. The conductive adhesive and the conductive pad form a shielding structure so as to prevent electromagnetic interference from occurring between the semiconductor element and the electronic element.

Abstract translation: 提供一种半导体封装，包括：具有至少导电焊盘的衬底; 设置在所述基板上的半导体元件; 形成在半导体元件的顶表面和侧表面上并延伸到导电焊盘的导电粘合剂; 以及设置在导电粘合剂上的电子元件。 导电粘合剂和导电垫形成屏蔽结构，以防止在半导体元件和电子元件之间发生电磁干扰。

公开(公告)号：US20190214352A1

公开(公告)日：2019-07-11

申请号：US16028798

申请日：2018-07-06

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Ming-Fan Tsai ,  Chih-Hsien Chiu ,  Tsung-Hsien Tsai ,  Chao-Ya Yang ,  Chia-Yang Chen

IPC: H01L23/66 ,  H01L23/498 ,  H01L23/31 ,  H01L23/552 ,  H01L23/04 ,  H01Q1/22 ,  H01Q1/24 ,  H01Q1/52

Abstract: The disclosure provides an electronic package, including a carrier, an electronic component disposed on the carrier, a buffer, and an antenna structure, wherein the antenna structure includes a metal frame disposed on the carrier and a wire disposed on the carrier and electrically connected to the metal frame, and the buffer covers the wire so as to reduce the emission wave speed of the wire and thus the wavelength is shorten, thereby satisfying the length requirement of the antenna within the limited space of the carrier and achieving an operating frequency radiated as required.

公开(公告)号：US20170103953A1

公开(公告)日：2017-04-13

申请号：US15298480

申请日：2016-10-20

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu ,  Hsin-Lung Chung ,  Cho-Hsin Chang ,  Chia-Yang Chen ,  Chao-Ya Yang

IPC: H01L23/552 ,  H01L21/48 ,  H01L25/065 ,  H01L23/66 ,  H01L23/31 ,  H01L23/00 ,  H01L21/56 ,  H01L21/78

CPC classification number: H01L23/552 ,  H01L21/485 ,  H01L21/4853 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/66 ,  H01L24/13 ,  H01L24/16 ,  H01L24/48 ,  H01L24/97 ,  H01L25/0655 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48157 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/1421 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2924/014 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A package structure includes a carrier, an electronic component disposed on the carrier, an encapsulant formed on the carrier for encapsulating the electronic component, a first shielding layer formed on the encapsulant, and a second shielding layer formed on the first shielding layer. The first and second shielding layers are made of different materials. With the multiple shielding layers formed on the encapsulating layer, the electronic component is protected from electromagnetic interferences. The present invention also provides a method for fabricating the package structure.