公开(公告)号：US20150333017A1

公开(公告)日：2015-11-19

申请号：US14459678

申请日：2014-08-14

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Cho-Hsin Chang ,  Tsung-Hsien Hsu ,  Hsin-Lung Chung ,  Te-Fang Chu ,  Chia-Yang Chen

IPC: H01L23/552 ,  H01L23/66 ,  H01L21/56

CPC classification number: H01L23/552 ,  H01L21/56 ,  H01L23/3121 ,  H01L23/66 ,  H01L24/13 ,  H01L24/16 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/1421 ,  H01L2924/15313 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/014 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: This invention provides a semiconductor package, including a substrate, a plurality of semiconductor elements disposed on the substrate, at least one shielding member disposed between at least two of the semiconductor elements, and an encapsulant encapsulating the semiconductor elements and shielding members. Through the shielding member, electromagnetic interference caused among semiconductor elements can be prevented.

Abstract translation: 本发明提供一种半导体封装，包括衬底，设置在衬底上的多个半导体元件，设置在至少两个半导体元件之间的至少一个屏蔽构件和封装半导体元件和屏蔽构件的密封剂。 通过屏蔽部件，可以防止半导体元件之间引起的电磁干扰。

公开(公告)号：US20210305148A1

公开(公告)日：2021-09-30

申请号：US16868038

申请日：2020-05-06

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Cho-Hsin Chang ,  Hao-Ju Fang ,  Ting-Wei Chi ,  Te-Fang Chu

IPC: H01L23/498 ,  H01L21/48

Abstract: A supporting structure is provided, which forms a protective layer on a metal member having a plurality of conductive posts, and the protective layer is exposed from end surfaces of the conductive posts, such that conductors are formed on the end surfaces of the conductive posts, thereby avoiding damage of the protective layer.

公开(公告)号：US09490219B2

公开(公告)日：2016-11-08

申请号：US14459678

申请日：2014-08-14

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Cho-Hsin Chang ,  Tsung-Hsien Hsu ,  Hsin-Lung Chung ,  Te-Fang Chu ,  Chia-Yang Chen

IPC: H01L23/552 ,  H01L21/56 ,  H01L23/66 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L23/552 ,  H01L21/56 ,  H01L23/3121 ,  H01L23/66 ,  H01L24/13 ,  H01L24/16 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/1421 ,  H01L2924/15313 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/014 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: This invention provides a semiconductor package, including a substrate, a plurality of semiconductor elements disposed on the substrate, at least one shielding member disposed between at least two of the semiconductor elements, and an encapsulant encapsulating the semiconductor elements and shielding members. Through the shielding member, electromagnetic interference caused among semiconductor elements can be prevented.

Abstract translation: 本发明提供一种半导体封装，包括衬底，设置在衬底上的多个半导体元件，设置在至少两个半导体元件之间的至少一个屏蔽构件和封装半导体元件和屏蔽构件的密封剂。 通过屏蔽部件，可以防止半导体元件之间引起的电磁干扰。

公开(公告)号：US20170236787A1

公开(公告)日：2017-08-17

申请号：US15584281

申请日：2017-05-02

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu ,  Hao-Ju Fang ,  Hsin-Lung Chung ,  Cho-Hsin Chang ,  Tsung-Hsien Tsai ,  Chia-Yang Chen ,  Chun-Chi Ke

IPC: H01L23/552 ,  H01L23/00 ,  H01L21/48 ,  H01L25/065 ,  H01L21/78 ,  H01L23/16 ,  H01L23/31 ,  H01L21/56 ,  H01L21/54

CPC classification number: H01L23/552 ,  H01L21/4853 ,  H01L21/54 ,  H01L21/561 ,  H01L21/563 ,  H01L21/78 ,  H01L23/16 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49838 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0655 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00012 ,  H01L2224/45099

Abstract: A semiconductor package is provided, including: a substrate having opposing first and second surfaces; a plurality of semiconductor components disposed on and electrically connected to the first surface; an encapsulant encapsulating the first surface and the semiconductor components and having at least one first groove that partitions the substrate into a plurality of package units, each of which has at least one of the semiconductor components; and a metal layer formed on the substrate and the encapsulant and encapsulating a periphery of the package units, with the second surface exposed from the metal layer, wherein the metal layer is formed along a wall surface of the first groove, to form a second groove corresponding in position to the first groove and having a metal surface. Therefore, the package units are isolated and form a multilayer isolated structure, including metal layers and air layers, and are electromagnetically shielded from one another.

公开(公告)号：US09673151B2

公开(公告)日：2017-06-06

申请号：US14837604

申请日：2015-08-27

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu ,  Hao-Ju Fang ,  Hsin-Lung Chung ,  Cho-Hsin Chang ,  Tsung-Hsien Tsai ,  Chia-Yang Chen ,  Chun-Chi Ke

IPC: H01L23/552 ,  H01L21/48 ,  H01L21/54 ,  H01L21/56 ,  H01L21/78 ,  H01L23/16 ,  H01L23/31 ,  H01L25/065 ,  H01L23/498

CPC classification number: H01L23/552 ,  H01L21/4853 ,  H01L21/54 ,  H01L21/561 ,  H01L21/563 ,  H01L21/78 ,  H01L23/16 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49838 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0655 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00012 ,  H01L2224/45099

Abstract: A semiconductor package is provided, including: a substrate having opposing first and second surfaces; a plurality of semiconductor components disposed on and electrically connected to the first surface; an encapsulant encapsulating the first surface and the semiconductor components and having at least one first groove that partitions the substrate into a plurality of package units, each of which has at least one of the semiconductor components; and a metal layer formed on the substrate and the encapsulant and encapsulating a periphery of the package units, with the second surface exposed from the metal layer, wherein the metal layer is formed along a wall surface of the first groove, to form a second groove corresponding in position to the first groove and having a metal surface. Therefore, the package units are isolated and form a multilayer isolated structure, including metal layers and air layers, and are electromagnetically shielded from one another.

公开(公告)号：US20170103953A1

公开(公告)日：2017-04-13

申请号：US15298480

申请日：2016-10-20

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu ,  Hsin-Lung Chung ,  Cho-Hsin Chang ,  Chia-Yang Chen ,  Chao-Ya Yang

IPC: H01L23/552 ,  H01L21/48 ,  H01L25/065 ,  H01L23/66 ,  H01L23/31 ,  H01L23/00 ,  H01L21/56 ,  H01L21/78

CPC classification number: H01L23/552 ,  H01L21/485 ,  H01L21/4853 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/66 ,  H01L24/13 ,  H01L24/16 ,  H01L24/48 ,  H01L24/97 ,  H01L25/0655 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48157 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/1421 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2924/014 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A package structure includes a carrier, an electronic component disposed on the carrier, an encapsulant formed on the carrier for encapsulating the electronic component, a first shielding layer formed on the encapsulant, and a second shielding layer formed on the first shielding layer. The first and second shielding layers are made of different materials. With the multiple shielding layers formed on the encapsulating layer, the electronic component is protected from electromagnetic interferences. The present invention also provides a method for fabricating the package structure.

公开(公告)号：US20160027740A1

公开(公告)日：2016-01-28

申请号：US14463999

申请日：2014-08-20

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu ,  Hsin-Lung Chung ,  Cho-Hsin Chang ,  Chia-Yang Chen ,  Chao-Ya Yang

IPC: H01L23/552 ,  H01L21/78 ,  H01L21/50 ,  H01L23/28

CPC classification number: H01L23/552 ,  H01L21/485 ,  H01L21/4853 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/66 ,  H01L24/13 ,  H01L24/16 ,  H01L24/48 ,  H01L24/97 ,  H01L25/0655 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48157 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/1421 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2924/014 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A package structure includes a carrier, an electronic component disposed on the carrier, an encapsulant formed on the carrier for encapsulating the electronic component, a first shielding layer formed on the encapsulant, and a second shielding layer formed on the first shielding layer. The first and second shielding layers are made of different materials. With the multiple shielding layers formed on the encapsulating layer, the electronic component is protected from electromagnetic interferences. The present invention also provides a method for fabricating the package structure.

Abstract translation: 封装结构包括载体，布置在载体上的电子部件，形成在载体上用于封装电子部件的密封剂，形成在密封剂上的第一屏蔽层和形成在第一屏蔽层上的第二屏蔽层。 第一和第二屏蔽层由不同的材料制成。 通过形成在封装层上的多个屏蔽层，电子部件被保护免受电磁干扰。 本发明还提供一种制造封装结构的方法。

公开(公告)号：US11527472B2

公开(公告)日：2022-12-13

申请号：US16868038

申请日：2020-05-06

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Cho-Hsin Chang ,  Hao-Ju Fang ,  Ting-Wei Chi ,  Te-Fang Chu

IPC: H01L23/498 ,  H01L21/48

Abstract: A supporting structure is provided, which forms a protective layer on a metal member having a plurality of conductive posts, and the protective layer is exposed from end surfaces of the conductive posts, such that conductors are formed on the end surfaces of the conductive posts, thereby avoiding damage of the protective layer.

公开(公告)号：US10074613B2

公开(公告)日：2018-09-11

申请号：US15584281

申请日：2017-05-02

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu ,  Hao-Ju Fang ,  Hsin-Lung Chung ,  Cho-Hsin Chang ,  Tsung-Hsien Tsai ,  Chia-Yang Chen ,  Chun-Chi Ke

IPC: H01L23/552 ,  H01L21/48 ,  H01L21/54 ,  H01L21/56 ,  H01L21/78 ,  H01L23/16 ,  H01L23/31 ,  H01L25/065 ,  H01L23/00 ,  H01L23/498

CPC classification number: H01L23/552 ,  H01L21/4853 ,  H01L21/54 ,  H01L21/561 ,  H01L21/563 ,  H01L21/78 ,  H01L23/16 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49838 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0655 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/85

Abstract: A semiconductor package is provided, including: a substrate having opposing first and second surfaces; a plurality of semiconductor components disposed on and electrically connected to the first surface; an encapsulant encapsulating the first surface and the semiconductor components and having at least one first groove that partitions the substrate into a plurality of package units, each of which has at least one of the semiconductor components; and a metal layer formed on the substrate and the encapsulant and encapsulating a periphery of the package units, with the second surface exposed from the metal layer, wherein the metal layer is formed along a wall surface of the first groove, to form a second groove corresponding in position to the first groove and having a metal surface. Therefore, the package units are isolated and form a multilayer isolated structure, including metal layers and air layers, and are electromagnetically shielded from one another.

公开(公告)号：US09899335B2

公开(公告)日：2018-02-20

申请号：US15298480

申请日：2016-10-20

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu ,  Hsin-Lung Chung ,  Cho-Hsin Chang ,  Chia-Yang Chen ,  Chao-Ya Yang

IPC: H01L21/00 ,  H01L23/52 ,  H01L23/58 ,  H01L23/552 ,  H01L21/56 ,  H01L21/48 ,  H01L21/78 ,  H01L23/66 ,  H01L23/31 ,  H01L23/00 ,  H01L25/065

CPC classification number: H01L23/552 ,  H01L21/485 ,  H01L21/4853 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/66 ,  H01L24/13 ,  H01L24/16 ,  H01L24/48 ,  H01L24/97 ,  H01L25/0655 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48157 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/1421 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2924/014 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A package structure includes a carrier, an electronic component disposed on the carrier, an encapsulant formed on the carrier for encapsulating the electronic component, a first shielding layer formed on the encapsulant, and a second shielding layer formed on the first shielding layer. The first and second shielding layers are made of different materials. With the multiple shielding layers formed on the encapsulating layer, the electronic component is protected from electromagnetic interferences. The present invention also provides a method for fabricating the package structure.