公开(公告)号：US12211776B2

公开(公告)日：2025-01-28

申请号：US17574944

申请日：2022-01-13

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Chih-Hsien Chiu ,  Ko-Wei Chang ,  Wen-Jung Tsai ,  Che-Wei Yu ,  Chia-Yang Chen

IPC: H01L23/552 ,  H01L21/48 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L25/00 ,  H01L25/065

Abstract: Provided is an electronic package, in which a conductive structure and an encapsulation layer covering the conductive structure are arranged on one side of a carrier structure having a circuit layer, and an electronic component is arranged on the other side of the carrier structure. The rigidity of the carrier structure is increased by the encapsulation layer, and problems such as warpage or wavy deformations caused by increasing the volume of the electronic package due to functional requirements can be eliminated.

公开(公告)号：US20220375822A1

公开(公告)日：2022-11-24

申请号：US17379289

申请日：2021-07-19

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Chih-Hsien Chiu ,  Siang-Yu Lin ,  Wen-Jung Tsai ,  Chia-Yang Chen ,  Chien-Cheng Lin

IPC: H01L23/42 ,  H01L23/31 ,  H01L23/367 ,  H01L23/16 ,  H01L21/56

Abstract: An electronic package is provided, which includes a plurality of electronic components encapsulated by an encapsulation layer. A spacer is defined in the encapsulation layer and located between at least two adjacent electronic components of the plurality of electronic components, and a recess is formed in the spacer and used as a thermal insulation area. With the design of the thermal insulation area, the plurality of electronic components can be effectively thermally insulated from one another to prevent heat generated by one electronic component of high power from being conducted to another electronic component of low power that would thermally affect the operation of the low-power electronic component. A method for manufacturing the electronic package is also provided.

公开(公告)号：US20220225493A1

公开(公告)日：2022-07-14

申请号：US17465335

申请日：2021-09-02

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Ming-Fan Tsai ,  Chih-Wei Chen ,  Chien-Cheng Lin ,  Chao-Ya Yang ,  Chia-Yang Chen

IPC: H05K1/02

Abstract: An electronic device is provided, in which an antenna module for receiving and transmitting radiation signals is disposed on a mounting surface of a circuit board, and an inner layer of the circuit board is formed with a ground surface to arrange a strip-shaped ground circuit along the edges of the ground surface so that the ground circuit occupies at most 50% of the area of the ground surface to improve antenna radiation efficiency.

公开(公告)号：US20180342484A1

公开(公告)日：2018-11-29

申请号：US15694613

申请日：2017-09-01

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu ,  Chia-Yang Chen ,  Chih-Chiang He

IPC: H01L25/065 ,  H01L25/00

Abstract: An electronic package and a method for fabricating the same are provided. A metal member including a supporting plate and a plurality of conductive pillars disposed on the supporting plate is provided. A circuit structure is coupled to the conductive pillars. An electronic component is disposed on the metal member and electrically connected to the circuit structure. An encapsulant encapsulates the conductive pillars and the electronic component. Any mold can be used for fabricating the electronic package, no matter what the size of the electronic package is. Therefore, the fabricating cost of the electronic package is reduced.

公开(公告)号：US20180315715A1

公开(公告)日：2018-11-01

申请号：US15660227

申请日：2017-07-26

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu ,  Chia-Yang Chen

IPC: H01L23/552 ,  H01L23/66 ,  H01L23/31 ,  H01L21/56

Abstract: An electronic package and a method for fabricating the same are provided. The method includes disposing an electronic component on a lower side of a first carrier and forming an encapsulant on an upper side of the first carrier. A first conductor is disposed on the encapsulant and configured for generating radiation energy by an alternating voltage, an alternating current or radiation variation. As such, the electronic package has a reduced thickness and improved antenna efficiency.

公开(公告)号：US09490219B2

公开(公告)日：2016-11-08

申请号：US14459678

申请日：2014-08-14

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Cho-Hsin Chang ,  Tsung-Hsien Hsu ,  Hsin-Lung Chung ,  Te-Fang Chu ,  Chia-Yang Chen

IPC: H01L23/552 ,  H01L21/56 ,  H01L23/66 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L23/552 ,  H01L21/56 ,  H01L23/3121 ,  H01L23/66 ,  H01L24/13 ,  H01L24/16 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/1421 ,  H01L2924/15313 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/014 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: This invention provides a semiconductor package, including a substrate, a plurality of semiconductor elements disposed on the substrate, at least one shielding member disposed between at least two of the semiconductor elements, and an encapsulant encapsulating the semiconductor elements and shielding members. Through the shielding member, electromagnetic interference caused among semiconductor elements can be prevented.

Abstract translation: 本发明提供一种半导体封装，包括衬底，设置在衬底上的多个半导体元件，设置在至少两个半导体元件之间的至少一个屏蔽构件和封装半导体元件和屏蔽构件的密封剂。 通过屏蔽部件，可以防止半导体元件之间引起的电磁干扰。

公开(公告)号：US20160081234A1

公开(公告)日：2016-03-17

申请号：US14607743

申请日：2015-01-28

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu ,  Hsin-Lung Chung ,  Chia-Yang Chen ,  Chao-Ya Yang ,  Yude Chu ,  Chih-Ming Cheng

IPC: H05K9/00

CPC classification number: H01L23/552 ,  H01L25/0657 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A package structure is provided, including an electronic element with a low frequency, a shielding member connected to the electrosnic element, and an encapsulant covering the electronic element and the shielding member, such that the electronic element is shielded from erroneous signals.

Abstract translation: 提供一种封装结构，包括低频电子元件，连接到电气元件的屏蔽构件，以及覆盖电子元件和屏蔽构件的密封剂，使得电子元件被屏蔽而不会发生错误信号。

公开(公告)号：US12057409B2

公开(公告)日：2024-08-06

申请号：US17571901

申请日：2022-01-10

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Chih-Hsien Chiu ,  Wen-Jung Tsai ,  Chien-Cheng Lin ,  Ko-Wei Chang ,  Yu-Wei Yeh ,  Shun-Yu Chien ,  Chia-Yang Chen

IPC: H01L23/00 ,  H01L23/16 ,  H01L23/31 ,  H01L23/498 ,  H01L23/58

CPC classification number: H01L23/562 ,  H01L23/3121 ,  H01L23/49822

Abstract: An electronic package and a manufacturing method of the electronic package are provided, in which an electronic component is arranged on a wiring structure and covered with a packaging layer, and a frame body that does not contact the wiring structure nor cover the electronic component is embedded in the packaging layer.

公开(公告)号：US11723144B2

公开(公告)日：2023-08-08

申请号：US17465335

申请日：2021-09-02

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Ming-Fan Tsai ,  Chih-Wei Chen ,  Chien-Cheng Lin ,  Chao-Ya Yang ,  Chia-Yang Chen

IPC: H05K1/02

CPC classification number: H05K1/0225 ,  H05K2201/10098

Abstract: An electronic device is provided, in which an antenna module for receiving and transmitting radiation signals is disposed on a mounting surface of a circuit board, and an inner layer of the circuit board is formed with a ground surface to arrange a strip-shaped ground circuit along the edges of the ground surface so that the ground circuit occupies at most 50% of the area of the ground surface to improve antenna radiation efficiency.

公开(公告)号：US11069633B2

公开(公告)日：2021-07-20

申请号：US16028798

申请日：2018-07-06

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Ming-Fan Tsai ,  Chih-Hsien Chiu ,  Tsung-Hsien Tsai ,  Chao-Ya Yang ,  Chia-Yang Chen

IPC: H01L23/66 ,  H01L23/498 ,  H01L23/552 ,  H01L23/04 ,  H01Q1/22 ,  H01Q1/52 ,  H01Q1/24 ,  H01Q9/42 ,  H01L23/31 ,  H01L23/00

Abstract: The disclosure provides an electronic package, including a carrier, an electronic component disposed on the carrier, a buffer, and an antenna structure, wherein the antenna structure includes a metal frame disposed on the carrier and a wire disposed on the carrier and electrically connected to the metal frame, and the buffer covers the wire so as to reduce the emission wave speed of the wire and thus the wavelength is shorten, thereby satisfying the length requirement of the antenna within the limited space of the carrier and achieving an operating frequency radiated as required.