发明申请
- 专利标题： Chip-on-Wafer Process Control Monitoring for Chip-on-Wafer-on-Substrate Packages
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申请号： US15414909申请日： 2017-01-25
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公开(公告)号： US20170133282A1公开(公告)日： 2017-05-11
- 发明人: Wei-Cheng Wu , Li-Han Hsu , Sao-Ling Chiu , Shang-Yun Hou , Shin-Puu Jeng , Chen-Hua Lin
- 申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 主分类号： H01L21/66
- IPC分类号： H01L21/66 ; G01R1/073 ; H01L25/065 ; H01L25/00 ; H01L23/00 ; G01R31/28 ; G01R31/265
摘要：
An embodiment method includes providing a standardized testing structure design for a chip-on-wafer (CoW) structure, wherein the standardized testing structure design comprises placing a testing structure in a pre-selected area a top die in the CoW structure, and electrically testing a plurality of microbumps in the CoW structure by applying a universal testing probe card to the testing structure.
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