Invention Application
- Patent Title: POLYPHENYLENE ETHER OLIGOMER AND HIGH-FREQUENCY COPPER CLAD LAMINATE
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Application No.: US15386669Application Date: 2016-12-21
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Publication No.: US20170174957A1Publication Date: 2017-06-22
- Inventor: Cheng-Po KUO , Po-Ju CHEN
- Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Applicant Address: TW Hsinchu
- Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee Address: TW Hsinchu
- Main IPC: C09J163/00
- IPC: C09J163/00 ; C07C69/54 ; C07C43/285 ; B32B27/06 ; C09J4/00 ; C09J7/02 ; B32B7/12 ; B32B15/04 ; C07C69/017 ; C07D303/24

Abstract:
A polyphenylene ether oligomer and a polyphenylene ether oligomer are provided. The polyphenylene ether oligomer has a structure represented by Formula (I): wherein each R1 can be independently hydrogen, C1-6 alkyl group, or phenyl group; each R2 can be independently hydrogen, C1-6 alkyl group, or phenyl group; a:(a+b) is from 0.05:1 to 1:1; n:(a+b) is from 0.05:1 to 5:1; Q can be m can be 0 or an integer from 1 to 4; Ra can be C1-6 alkylene group; Rb can be C1-6 alkylene group; each X is independently hydrogen, acryloyl group, allyl group, vinylbenzyl group, epoxypropyl group, methacryloyl group, propargyl group, or cyanol group; and wherein the polyphenylene ether oligomer can have a number average molecular weight from 400 to 2,000.
Public/Granted literature
- US10358585B2 Polyphenylene ether oligomer and high-frequency copper clad laminate Public/Granted day:2019-07-23
Information query