Invention Application
- Patent Title: CMOS-MEMS STRUCTURE AND METHOD OF FORMING THE SAME
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Application No.: US15457498Application Date: 2017-03-13
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Publication No.: US20170183222A1Publication Date: 2017-06-29
- Inventor: JUNG-HUEI PENG , CHIA-HUA CHU , FEI-LUNG LAI , SHIANG-CHI LIN
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Main IPC: B81C1/00
- IPC: B81C1/00

Abstract:
The present disclosure provides a CMOS structure, including a substrate, a metallization layer over the substrate, a sensing structure over the metallization layer, and a signal transmitting structure adjacent to the sensing structure. The sensing structure includes an outgassing layer over the metallization layer, a patterned outgassing barrier over the outgassing layer; and an electrode over the patterned outgassing barrier. The signal transmitting structure electrically couples the electrode and the metallization layer.
Public/Granted literature
- US10046965B2 CMOS-MEMS structure and method of forming the same Public/Granted day:2018-08-14
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