Invention Application
- Patent Title: Transmission Line Coupler for Testing of Integrated Circuits
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Application No.: US15051134Application Date: 2016-02-23
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Publication No.: US20170199226A1Publication Date: 2017-07-13
- Inventor: Timothy SCRANTON , Michael BOERS , Seunghwan YOON , Jesus CASTANEDA
- Applicant: Broadcom Corporation
- Applicant Address: US CA Irvine
- Assignee: Broadcom Corporation
- Current Assignee: Broadcom Corporation
- Current Assignee Address: US CA Irvine
- Main IPC: G01R1/073
- IPC: G01R1/073 ; G01R31/28 ; H01P5/12

Abstract:
The present disclosure describes a semiconductor wafer testing environment for routing signals used for testing integrated circuits formed onto a semiconductor wafer. The semiconductor wafer testing environment includes a semiconductor wafer tester to control overall operation and/or configuration of the semiconductor wafer testing environment and a semiconductor wafer prober to test the integrated circuits formed onto the semiconductor wafer. The semiconductor wafer prober includes a probe card having a transmission line coupler formed onto a flexible substrate. The transmission line coupler includes multiple transmission line coupling blocks that extend radially from a central point of the flexible substrate in a circular manner.
Public/Granted literature
- US10254312B2 Transmission line coupler for testing of integrated circuits Public/Granted day:2019-04-09
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