公开(公告)号：US20170047667A1

公开(公告)日：2017-02-16

申请号：US14854832

申请日：2015-09-15

Applicant: BROADCOM CORPORATION

Inventor： Saikat SARKAR ,  Seunghwan YOON ,  Bagher AFSHAR ,  Michael BOERS ,  Jesus CASTANEDA ,  Tirdad SOWLATI

IPC: H01Q23/00 ,  H01Q3/30 ,  H01Q3/24

CPC classification number: H01P5/16 ,  H01P1/15

Abstract: An electronic device includes circuitry configured to determine an antenna operation mode for one or more antenna arrays. The circuitry is further configured to control the one or more antenna arrays to operate in a combined antenna mode via a Wilkinson combiner. The circuitry is also configured to control the one or more antenna arrays to operate in an isolated antenna mode via a single-pole, multi-throw switch.

Abstract translation: 电子设备包括被配置为确定一个或多个天线阵列的天线操作模式的电路。 电路还被配置成通过威尔金森组合器控制一个或多个天线阵列以组合天线方式工作。 该电路还被配置为通过单刀多掷开关来控制一个或多个天线阵列以隔离天线方式工作。

公开(公告)号：US20160150542A1

公开(公告)日：2016-05-26

申请号：US14952871

申请日：2015-11-25

Applicant: BROADCOM CORPORATION

Inventor： Alireza TARIGHAT MEHRABANI ,  Michael BOERS ,  Masoud KAHRIZI ,  Tirdad SOWLATI ,  Bagher AFSHAR ,  Payam TORAB JAHROMI ,  Sean Timothy NICOLSON ,  Brima Babatunde IBRAHIM

IPC: H04W72/04 ,  H04W16/28

CPC classification number: H04W16/28 ,  H04W88/085

Abstract: A device implementing the subject scalable radio frequency communication system includes one or more primary radio frequency integrated circuits (RFICs) and at least one secondary RFIC. Each of the one or more primary RFICs is configured to receive an intermediate frequency (IF) signal from a baseband processor, upconvert the IF signal to a radio frequency (RF) signal, and transmit the RF signal to one or more secondary RFICs. The secondary RFICs under each of the one or more primary RFICs are configured to receive the RF signal from the corresponding primary RFIC, phase shift and amplify the RF signal, and transmit the RF signal via a plurality of antenna elements.

Abstract translation: 实现主题可缩放射频通信系统的设备包括一个或多个主要射频集成电路（RFIC）和至少一个次要RFIC。 一个或多个主要RFIC中的每个被配置为从基带处理器接收中频（IF）信号，将IF信号上变频到射频（RF）信号，并将RF信号发送到一个或多个次要RFIC。 在一个或多个主要RFIC中的每一个下面的次要RFIC被配置为从相应的主RFIC接收RF信号，相移并放大RF信号，并且经由多个天线元件发送RF信号。

公开(公告)号：US20130311127A1

公开(公告)日：2013-11-21

申请号：US13944430

申请日：2013-07-17

Applicant: Broadcom Corporation

Inventor： Arya Reza BEHZAD ,  Ahmadreza ROFOUGARAN ,  Sam Ziqun ZHAO ,  Jesus Alfonso CASTANEDA ,  Michael BOERS

IPC: G01R31/319

CPC classification number: G01R31/319 ,  G01R31/2834 ,  G01R31/3025 ,  G01R31/311 ,  H01L23/544 ,  H01L2223/54433 ,  H01L2924/0002 ,  Y10T29/49121 ,  H01L2924/00

Abstract: Methods and apparatus are disclosed to simultaneously, wirelessly test semiconductor components formed on a semiconductor wafer. The semiconductor components transmit respective outcomes of a self-contained testing operation to wireless automatic test equipment via a common communication channel. Multiple receiving antennas observe the outcomes from multiple directions in three dimensional space. The wireless automatic test equipment determines whether one or more of the semiconductor components operate as expected and, optionally, may use properties of the three dimensional space to determine a location of one or more of the semiconductor components. The wireless testing equipment may additionally determine performance of the semiconductor components by detecting infrared energy emitted, transmitted, and/or reflected by the semiconductor wafer before, during, and/or after a self-contained testing operation.

Abstract translation: 公开了同时无线地测试形成在半导体晶片上的半导体元件的方法和装置。 半导体部件通过公共通信信道将各自的测试结果传送到无线自动测试设备。 多个接收天线在三维空间中观察多个方向的结果。 无线自动测试设备确定一个或多个半导体组件是否按预期运行，并且可选地，可以使用三维空间的属性来确定一个或多个半导体组件的位置。 无线测试设备还可以通过检测在独立测试操作之前，期间和/或之后由半导体晶片发射，传输和/或反射的红外能量来确定半导体组件的性能。

公开(公告)号：US20170199226A1

公开(公告)日：2017-07-13

申请号：US15051134

申请日：2016-02-23

Applicant: Broadcom Corporation

Inventor： Timothy SCRANTON ,  Michael BOERS ,  Seunghwan YOON ,  Jesus CASTANEDA

IPC: G01R1/073 ,  G01R31/28 ,  H01P5/12

CPC classification number: G01R1/0735 ,  G01R1/0416 ,  G01R31/2831 ,  H01P5/028 ,  H01P5/12

Abstract: The present disclosure describes a semiconductor wafer testing environment for routing signals used for testing integrated circuits formed onto a semiconductor wafer. The semiconductor wafer testing environment includes a semiconductor wafer tester to control overall operation and/or configuration of the semiconductor wafer testing environment and a semiconductor wafer prober to test the integrated circuits formed onto the semiconductor wafer. The semiconductor wafer prober includes a probe card having a transmission line coupler formed onto a flexible substrate. The transmission line coupler includes multiple transmission line coupling blocks that extend radially from a central point of the flexible substrate in a circular manner.

公开(公告)号：US20150282235A1

公开(公告)日：2015-10-01

申请号：US14680825

申请日：2015-04-07

Applicant: Broadcom Corporation

Inventor： Ahmadreza (Reza) ROFOUGARAN ,  Arya Reza BEHZAD ,  Sam Ziqun ZHAO ,  Jesus Alfonso CASTANEDA ,  Michael BOERS

IPC: H04W76/02 ,  H04W4/00 ,  H04B5/00

CPC classification number: G06F9/50 ,  H04B5/0037 ,  H04B7/10 ,  H04B7/26 ,  H04W4/80 ,  H04W84/18 ,  Y10T307/492

Abstract: Embodiments of the present invention are directed to a wireless-enabled component (WEC) for enabling a wireless bus for intra-chip and inter-chip communication. A WEC encompasses a functional block of an IC (such as, for example, a processing core of a processing unit), an entire IC (such as, for example, a processing unit), or a device that includes a plurality of ICs (such as, for example, a handheld device). According to embodiments, a WEC may be associated with one or more sub-blocks of an IC, a single IC, or a plurality of ICs.

Abstract translation: 本发明的实施例涉及一种能够使无线总线进行片内和芯片间通信的无线使能分量（WEC）。 WEC包括IC（例如处理单元的处理核心）的功能块，整个IC（例如，处理单元）或包括多个IC的设备（ 例如手持设备）。 根据实施例，WEC可以与IC，单个IC或多个IC的一个或多个子块相关联。